Authors:
VAKANAS L
HASAN S
CANGELLARIS A
PRINCE JL
Citation: L. Vakanas et al., EFFECTS OF FLOATING PLANES IN 3-DIMENSIONAL PACKAGING STRUCTURES ON SIMULTANEOUS SWITCHING NOISE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(4), 1998, pp. 434-440
Citation: Hp. Yue et al., DIELECTRIC-CONSTANT AND LOSS TANGENT MEASUREMENT USING A STRIPLINE FIXTURE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(4), 1998, pp. 441-446
Citation: Cs. Desai et al., THERMOMECHANICAL ANALYSIS IN ELECTRONIC PACKAGING WITH UNIFIED CONSTITUTIVE MODEL FOR MATERIALS AND JOINTS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 87-97
Citation: Jl. Prince et A. Deutsch, FOREWORD - CONTRIBUTIONS FROM THE 5TH TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 264-265
Citation: L. Lin et Jl. Prince, SSO NOISE ELECTRICAL PERFORMANCE LIMITATIONS FOR PQFP PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 292-297
Citation: Cs. Desai et al., THERMOMECHANICAL RESPONSE OF MATERIALS AND INTERFACES IN ELECTRONIC PACKAGING - PART-I - UNIFIED CONSTITUTIVE MODEL AND CALIBRATION, Journal of electronic packaging, 119(4), 1997, pp. 294-300
Citation: Cs. Desai et al., THERMOMECHANICAL RESPONSE OF MATERIALS AND INTERFACES IN ELECTRONIC PACKAGING - PART-II - UNIFIED CONSTITUTIVE MODELS, VALIDATION, AND DESIGN, Journal of electronic packaging, 119(4), 1997, pp. 301-309
Citation: C. Huang et al., EFFICIENT DESIGN SIMULATION ALGORITHMS FOR SIMULTANEOUS SWITCHING NOISE IN LEADFRAME PACKAGES/, Microsystem technologies, 3(4), 1997, pp. 178-182
Citation: Da. Secker et Jl. Prince, EFFECTS AND MODELING OF SIMULTANEOUS SWITCHING NOISE FOR BICMOS OFF-CHIP DRIVERS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(3), 1996, pp. 473-480
Citation: C. Huang et al., A SIMULTANEOUS SWITCHING NOISE DESIGN ALGORITHM FOR LEADFRAME PACKAGES WITH OR WITHOUT GROUND PLANE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 15-22
Citation: Ce. Abernethy et al., A NOVEL METHOD OF MEASURING MICROELECTRONIC INTERCONNECT TRANSMISSION-LINE PARAMETERS AND DISCONTINUITY EQUIVALENT ELECTRICAL PARAMETERS USING MULTIPLE REFLECTIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 32-39
Citation: Jl. Prince, CONVOLUTION BACKPROJECTION FORMULAS FOR 3-D VECTOR TOMOGRAPHY WITH APPLICATION TO MRI, IEEE transactions on image processing, 5(10), 1996, pp. 1462-1472
Authors:
DAVATZIKOS C
VAILLANT M
RESNICK SM
PRINCE JL
LETOVSKY S
BRYAN RN
Citation: C. Davatzikos et al., A COMPUTERIZED APPROACH FOR MORPHOLOGICAL ANALYSIS OF THE CORPUS-CALLOSUM, Journal of computer assisted tomography, 20(1), 1996, pp. 88-97
Authors:
VAIDYANATH A
THORODDSEN B
PRINCE JL
CANGELLARIS AC
Citation: A. Vaidyanath et al., SIMULTANEOUS SWITCHING NOISE - INFLUENCE OF PLANE-PLANE AND PLANE-SIGNAL TRACE COUPLING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(3), 1995, pp. 496-502
Citation: Ts. Denney et Jl. Prince, FREQUENCY-DOMAIN PERFORMANCE ANALYSIS OF HORN AND SCHNUCKS OPTICAL-FLOW ALGORITHM FOR DEFORMABLE MOTION, IEEE transactions on image processing, 4(9), 1995, pp. 1324-1328
Citation: Ts. Denney et Jl. Prince, RECONSTRUCTION OF 3-D LEFT-VENTRICULAR MOTION FROM PLANAR TAGGED CARDIAC MR-IMAGES - AN ESTIMATION THEORETIC APPROACH, IEEE transactions on medical imaging, 14(4), 1995, pp. 625-635
Citation: A. Vaidyanath et al., EFFECT OF CMOS DRIVER LOADING CONDITIONS ON SIMULTANEOUS SWITCHING NOISE, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 480-485