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Results: 1-11 |
Results: 11
Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
Authors: Schaufelbuhl, A Schneeberger, N Munch, U Waeliti, M Paul, O Brand, O Baltes, H Menolofi, C Huang, QT Doering, E Loefe, M
Citation: A. Schaufelbuhl et al., Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array, J MICROEL S, 10(4), 2001, pp. 503-510
Operation and short-term drift of polysilicon-heated CMOS microstructures at temperatures up to 1200 K
Authors: Ehmann, M Ruther, P von Arx, M Paul, O
Citation: M. Ehmann et al., Operation and short-term drift of polysilicon-heated CMOS microstructures at temperatures up to 1200 K, J MICROM M, 11(4), 2001, pp. 397-401
Surface micromachined ring test structures to determine mechanical properties of compressive thin films
Authors: Kramer, T Paul, O
Citation: T. Kramer et O. Paul, Surface micromachined ring test structures to determine mechanical properties of compressive thin films, SENS ACTU-A, 92(1-3), 2001, pp. 292-298
Mechanical reliability of MEMS-structures under shock load
Authors: Wagner, U Franz, J Schweiker, M Bernhard, W Muller-Fiedler, R Michel, B Paul, O
Citation: U. Wagner et al., Mechanical reliability of MEMS-structures under shock load, MICROEL REL, 41(9-10), 2001, pp. 1657-1662
Improving, packet filters management through automatic and dynamic schemes
Authors: Paul, O Laurent, M
Citation: O. Paul et M. Laurent, Improving, packet filters management through automatic and dynamic schemes, ANN TELECOM, 56(9-10), 2001, pp. 595-608
Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
Authors: Mayer, M Paul, O Bolliger, D Baltes, H
Citation: M. Mayer et al., Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process, IEEE T COMP, 23(2), 2000, pp. 393-398
Process-dependent thin-film thermal conductivities for thermal CMOS MEMS
Authors: von Arx, M Paul, O Baltes, H
Citation: M. Von Arx et al., Process-dependent thin-film thermal conductivities for thermal CMOS MEMS, J MICROEL S, 9(1), 2000, pp. 136-145
A thermal van der Pauw test structure
Authors: Paul, O Ruther, P Plattner, L Baltes, H
Citation: O. Paul et al., A thermal van der Pauw test structure, IEEE SEMIC, 13(2), 2000, pp. 159-166
Strongly buckled square micromachined membranes
Authors: Ziebart, V Paul, O Baltes, H
Citation: V. Ziebart et al., Strongly buckled square micromachined membranes, J MICROEL S, 8(4), 1999, pp. 423-432
Mechanical behavior and sound generation efficiency of prestressed, elastically clamped and thermomechanically driven thin film sandwiches
Authors: Paul, O Baltes, H
Citation: O. Paul et H. Baltes, Mechanical behavior and sound generation efficiency of prestressed, elastically clamped and thermomechanically driven thin film sandwiches, J MICROM M, 9(1), 1999, pp. 19-29
A CMOS-compatible device for fluid density measurements fabricated by sacrificial aluminium etching
Authors: Westberg, D Paul, O Andersson, GI Baltes, H
Citation: D. Westberg et al., A CMOS-compatible device for fluid density measurements fabricated by sacrificial aluminium etching, SENS ACTU-A, 73(3), 1999, pp. 243-251
Risultati: 1-11 |