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Results: 1-12 |
Results: 12
MASK ALIGNERS IN ADVANCED PACKAGING
Authors: TONNIES D TOPPER M WOLF J ENGELMANN G REICHL H
Citation: D. Tonnies et al., MASK ALIGNERS IN ADVANCED PACKAGING, Solid state technology, 41(3), 1998, pp. 13
HIGH-POWER MULTICHIP MODULES EMPLOYING THE PLANAR EMBEDDING TECHNIQUEAND MICROCHANNEL WATER HEAT SINKS
Authors: HAHN R KAMP A GINOLAS A SCHMIDT M WOLF J GLAW V TOPPER M EHRMANN O REICHL H
Citation: R. Hahn et al., HIGH-POWER MULTICHIP MODULES EMPLOYING THE PLANAR EMBEDDING TECHNIQUEAND MICROCHANNEL WATER HEAT SINKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 432-441
LASER BUMPING PROCESS FOR GAAS DEVICES
Authors: METZGER D REICHL H
Citation: D. Metzger et H. Reichl, LASER BUMPING PROCESS FOR GAAS DEVICES, Microelectronics, 28(4), 1997, pp. 475-487
RELIABILITY AND AU-CONCENTRATION IN OLB SOLDER FILLETS OF TAB-DEVICESHAVING A 75 MU-M PITCH
Authors: ZAKEL E VILLAIN J REICHL H
Citation: E. Zakel et al., RELIABILITY AND AU-CONCENTRATION IN OLB SOLDER FILLETS OF TAB-DEVICESHAVING A 75 MU-M PITCH, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 138-147
RELIABILITY INVESTIGATIONS OF FLUXLESS FLIP-CHIP INTERCONNECTIONS ON GREEN TAPE CERAMIC SUBSTRATES
Authors: KLOESER J ZAKEL E BECHTOLD F REICHL H
Citation: J. Kloeser et al., RELIABILITY INVESTIGATIONS OF FLUXLESS FLIP-CHIP INTERCONNECTIONS ON GREEN TAPE CERAMIC SUBSTRATES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 24-33
MOUNTING OF HIGH-POWER LASER-DIODES ON DIAMOND HEATSINKS
Authors: WEISS S ZAKEL E REICHL H
Citation: S. Weiss et al., MOUNTING OF HIGH-POWER LASER-DIODES ON DIAMOND HEATSINKS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 46-53
ELECTROLESS NICKEL COPPER PLATING AS A NEW BUMP METALLIZATION
Authors: ASCHENBRENNER R OSTMANN A BEUTLER U SIMON J REICHL H
Citation: R. Aschenbrenner et al., ELECTROLESS NICKEL COPPER PLATING AS A NEW BUMP METALLIZATION, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 18(2), 1995, pp. 334-338
RELIABILITY INVESTIGATIONS OF DIFFERENT TAPE METALLIZATIONS FOR TAB-OUTER LEAD BONDING
Authors: ZAKEL E AZDASHT G KRUPPA P REICHL H
Citation: E. Zakel et al., RELIABILITY INVESTIGATIONS OF DIFFERENT TAPE METALLIZATIONS FOR TAB-OUTER LEAD BONDING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 537-546
DEGRADATION OF TAB OUTER LEAD CONTACTS DUE TO THE AU-CONCENTRATION INEUTECTIC TIN-LEAD SOLDER
Authors: ZAKEL E AZDASHT G REICHL H
Citation: E. Zakel et al., DEGRADATION OF TAB OUTER LEAD CONTACTS DUE TO THE AU-CONCENTRATION INEUTECTIC TIN-LEAD SOLDER, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 569-577
ANNEALING BEHAVIOR OF THE SPECIFIC CONTACT LAYER RESISTIVITY FOR AN AU BUMP-TIW-AL PAD STRUCTURE
Authors: SUN YC EHRMANN O WOLF J REICHL H
Citation: Yc. Sun et al., ANNEALING BEHAVIOR OF THE SPECIFIC CONTACT LAYER RESISTIVITY FOR AN AU BUMP-TIW-AL PAD STRUCTURE, Semiconductor science and technology, 9(9), 1994, pp. 1686-1689
LASER DIRECT WRITING OF GOLD TO REPAIR DEFECTIVE LINES IN THIN-FILM METALLIZATIONS
Authors: METZGER D REICHL H
Citation: D. Metzger et H. Reichl, LASER DIRECT WRITING OF GOLD TO REPAIR DEFECTIVE LINES IN THIN-FILM METALLIZATIONS, Applied surface science, 69(1-4), 1993, pp. 69-74
AU-SN BONDING METALLURGY OF TAB CONTACTS AND ITS INFLUENCE ON THE KIRKENDALL EFFECT IN THE TERNARY CU-AU-SN
Authors: ZAKEL E REICHL H
Citation: E. Zakel et H. Reichl, AU-SN BONDING METALLURGY OF TAB CONTACTS AND ITS INFLUENCE ON THE KIRKENDALL EFFECT IN THE TERNARY CU-AU-SN, IEEE transactions on components, hybrids, and manufacturing technology, 16(3), 1993, pp. 323-332
Risultati: 1-12 |