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Citation: Km. Han et Ct. Sah, POSITIVE OXIDE CHARGE FROM HOT HOLE INJECTION DURING CHANNEL-HOT-ELECTRON STRESS, I.E.E.E. transactions on electron devices, 45(7), 1998, pp. 1624-1627
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Citation: Sv. Walstra et Ct. Sah, THIN OXIDE THICKNESS EXTRAPOLATION FROM CAPACITANCE-VOLTAGE MEASUREMENTS, I.E.E.E. transactions on electron devices, 44(7), 1997, pp. 1136-1142
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Authors:
NEUGROSCHEL A
SAH CT
FORD JM
STEELE J
TANG R
STEIN C
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Authors:
SAH CT
NEUGROSCHEL A
HAN KM
KAVALIEROS JT
Citation: Ct. Sah et al., PROFILING INTERFACE TRAPS IN MOS-TRANSISTORS BY THE DC CURRENT-VOLTAGE METHOD, IEEE electron device letters, 17(2), 1996, pp. 72-74
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Citation: Jt. Kavalieros et Ct. Sah, SEPARATION OF INTERFACE AND NONUNIFORM BRIDE TRAPS BY THE DC CURRENT-VOLTAGE METHOD, I.E.E.E. transactions on electron devices, 43(1), 1996, pp. 137-141
Citation: A. Neugroschel et Ct. Sah, MEASUREMENT OF BUILT-IN ELECTRIC-FIELD IN BASE OF SI GEXSI1-X/SI HBT WITH LINEARLY-GRADED GE PROFILE/, Electronics Letters, 32(24), 1996, pp. 2280-2282
Citation: Y. Lu et Ct. Sah, ENERGY AND MOMENTUM CONSERVATION DURING ENERGETIC-CARRIER GENERATION AND RECOMBINATION IN SILICON, Physical review. B, Condensed matter, 52(8), 1995, pp. 5657-5664
Authors:
NEUGROSCHEL A
SAH CT
HAN KM
CARROLL MS
NISHIDA T
KAVALIEROS JT
LU Y
Citation: A. Neugroschel et al., DIRECT-CURRENT MEASUREMENTS OF OXIDE AND INTERFACE TRAPS ON OXIDIZED SILICON, I.E.E.E. transactions on electron devices, 42(9), 1995, pp. 1657-1662
Citation: A. Neugroschel et al., CURRENT-ACCELERATION FOR RAPID TIME-TO-FAILURE DETERMINATION OF BIPOLAR JUNCTION TRANSISTORS UNDER EMITTER-BASE REVERSE-BIAS STRESS, I.E.E.E. transactions on electron devices, 42(7), 1995, pp. 1380-1383
Citation: A. Neugroschel et al., RANDOM TELEGRAPHIC SIGNALS IN SILICON BIPOLAR JUNCTION TRANSISTORS, Applied physics letters, 66(21), 1995, pp. 2879-2881
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