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Results: 1-10 |
Results: 10
New method for high-performance liquid chromatographic separation and fluorescence detection of ginsenosides
Authors: Shangguan, D Han, HW Zhao, R Zhao, YX Xiong, SX Liu, GQ
Citation: D. Shangguan et al., New method for high-performance liquid chromatographic separation and fluorescence detection of ginsenosides, J CHROMAT A, 910(2), 2001, pp. 367-372
Mechanism of contact enhancing chemicals for electrical interconnection
Authors: Gao, G Shangguan, D
Citation: G. Gao et D. Shangguan, Mechanism of contact enhancing chemicals for electrical interconnection, IEEE T COMP, 23(3), 2000, pp. 535-541
Fracture of Sn-3.5%Ag solder alloy under creep
Authors: Igoshev, VI Kleiman, JI Shangguan, D Wong, S Michon, U
Citation: Vi. Igoshev et al., Fracture of Sn-3.5%Ag solder alloy under creep, J ELEC MAT, 29(12), 2000, pp. 1356-1361
Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure
Authors: Chada, S Fournelle, RA Laub, W Shangguan, D
Citation: S. Chada et al., Copper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure, J ELEC MAT, 29(10), 2000, pp. 1214-1221
A modified finite element method for determining equilibrium capillary surfaces of liquids with specified volumes
Authors: Nigro, NJ Zellmer, BP Shangguan, D Lee, PS
Citation: Nj. Nigro et al., A modified finite element method for determining equilibrium capillary surfaces of liquids with specified volumes, INT J NUM F, 33(6), 2000, pp. 833-846
Study of microstructure simulation of spheroidal graphite cast iron
Authors: Liu, BC Zhao, HD Liu, WY Wang, DT Shangguan, D Cheng, J
Citation: Bc. Liu et al., Study of microstructure simulation of spheroidal graphite cast iron, INT J CAST, 11(6), 1999, pp. 471-476
Investigation of a new lead free solder alloy using thin strip specimens
Authors: Ren, W Qian, Z Lu, M Liu, S Shangguan, D
Citation: W. Ren et al., Investigation of a new lead free solder alloy using thin strip specimens, J ELEC PACK, 121(4), 1999, pp. 271-274
Analysis of crack growth in solder joints
Authors: Shangguan, D
Citation: D. Shangguan, Analysis of crack growth in solder joints, SOLDER S MT, 11(3), 1999, pp. 27-32
An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates
Authors: Chada, S Laub, W Fournelle, RA Shangguan, D
Citation: S. Chada et al., An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates, J ELEC MAT, 28(11), 1999, pp. 1194-1202
Microstructure changes in Sn-3.5Ag solder alloy during creep
Authors: Igoshev, VI Kleiman, JI Shangguan, D Lock, C Wong, S Wiseman, M
Citation: Vi. Igoshev et al., Microstructure changes in Sn-3.5Ag solder alloy during creep, J ELEC MAT, 27(12), 1998, pp. 1367-1371
Risultati: 1-10 |