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Results:
1-7
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Results: 7
Authors:
FU C
MCDOWELL DL
UME IC
Citation: C. Fu et al., A FINITE-ELEMENT PROCEDURE OF A CYCLIC THERMOVISCOPLASTICITY MODEL FOR SOLDER AND COPPER INTERCONNECTS, Journal of electronic packaging, 120(1), 1998, pp. 24-34
Authors:
FU CY
UME IC
MCDOWELL DL
Citation: Cy. Fu et al., THERMAL-STRESS AND FATIGUE ANALYSIS OF PLATED-THROUGH HOLES USING AN INTERNAL STATE-VARIABLE CONSTITUTIVE MODEL, Finite elements in analysis and design, 30(1-2), 1998, pp. 1-17
Authors:
UME IC
MARTIN T
GATRO JT
Citation: Ic. Ume et al., FINITE-ELEMENT ANALYSIS OF PWB WARPAGE DUE TO THE SOLDER MASKING PROCESS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(3), 1997, pp. 295-306
Authors:
UME IC
MARTIN T
Citation: Ic. Ume et T. Martin, FINITE-ELEMENT ANALYSIS OF PWB WARPAGE DUE TO CURED SOLDER MASK - SENSITIVITY ANALYSIS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(3), 1997, pp. 307-316
Authors:
STITELER MR
UME IC
Citation: Mr. Stiteler et Ic. Ume, SYSTEM FOR REAL-TIME MEASUREMENT OF THERMALLY-INDUCED PWB PWA WARPAGE/, Journal of electronic packaging, 119(1), 1997, pp. 1-7
Authors:
GRAHAM GM
UME IC
Citation: Gm. Graham et Ic. Ume, AUTOMATED-SYSTEM FOR LASER ULTRASONIC SENSING OF WELD PENETRATION, Mechatronics, 7(8), 1997, pp. 711-721
Authors:
STITELER MR
UME IC
LEUTZ B
Citation: Mr. Stiteler et al., IN-PROCESS BOARD WARPAGE MEASUREMENT IN A LAB SCALE WAVE SOLDERING OVEN, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 562-569
Risultati:
1-7
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