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Results: 26-50/1416
Authors:
Jones, RH
Citation: Rh. Jones, Advancing our understanding of localized corrosion, JOM-J MIN, 53(7), 2001, pp. 28-28
Authors:
Buchheit, RG
Boger, RK
Carroll, MC
Leard, RM
Paglia, C
Searles, JL
Citation: Rg. Buchheit et al., The electrochemistry of intermetallic particles and localized corrosion inAl alloys, JOM-J MIN, 53(7), 2001, pp. 29
Authors:
Missert, N
Barbour, JC
Copeland, RG
Mikkalson, JE
Citation: N. Missert et al., The localized corrosion of Al at engineered Cu islands, JOM-J MIN, 53(7), 2001, pp. 34-36
Authors:
Windisch, CF
Baer, DR
Engelhard, MH
Jones, RH
Citation: Cf. Windisch et al., Analyzing localized corrosion in ion-implanted metals via XPS/AES, JOM-J MIN, 53(7), 2001, pp. 37-41
Authors:
Shaw, BA
McCosby, MM
Abdullah, AM
Pickering, HW
Citation: Ba. Shaw et al., The localized corrosion of Al 6XXX alloys, JOM-J MIN, 53(7), 2001, pp. 42-46
Authors:
Hale, W
Citation: W. Hale, TMS begins strategic planning: Members, mission, and materials, JOM-J MIN, 53(7), 2001, pp. 56-56
Authors:
Roncone, K
Citation: K. Roncone, ASTRA provides a voice for the physical sciences, JOM-J MIN, 53(6), 2001, pp. 11-11
Authors:
Byko, M
Citation: M. Byko, Designers make their mark with computer chips, JOM-J MIN, 53(6), 2001, pp. 12-13
Authors:
Kang, SK
Citation: Sk. Kang, Recent progress in Pb-tree solders and soldering technologies, JOM-J MIN, 53(6), 2001, pp. 16-16
Authors:
Gayle, FW
Becka, G
Badgett, J
Whitten, G
Pan, TY
Grusd, A
Bauer, B
Lathrop, R
Slattery, J
Anderson, I
Foley, J
Gickler, A
Napp, D
Mather, J
Olson, C
Citation: Fw. Gayle et al., High temperature lead-free solder for microelectronics, JOM-J MIN, 53(6), 2001, pp. 17-21
Authors:
Choi, S
Lee, JG
Guo, F
Bieler, TR
Subramanian, KN
Lucas, JP
Citation: S. Choi et al., Creep properties of Sn-Ag solder joints containing intermetallic particles, JOM-J MIN, 53(6), 2001, pp. 22-26
Authors:
Frear, DR
Jang, JW
Lin, JK
Zhang, C
Citation: Dr. Frear et al., Pb-free solders for flip-chip interconnects, JOM-J MIN, 53(6), 2001, pp. 28
Authors:
Gagliano, RA
Fine, ME
Citation: Ra. Gagliano et Me. Fine, Growth of eta phase scallops and whiskers in liquid tin-solid copper reaction couples, JOM-J MIN, 53(6), 2001, pp. 33-38
Authors:
Kariya, Y
Williams, N
Gagg, C
Plumbridge, W
Citation: Y. Kariya et al., Tin pest in Sn-0.5 wt.% Cu lead-free solder, JOM-J MIN, 53(6), 2001, pp. 39-41
Authors:
Ravindra, NM
Kumar, A
Citation: Nm. Ravindra et A. Kumar, Advances in microelectronic processing, JOM-J MIN, 53(6), 2001, pp. 42-42
Authors:
Merchant, SM
Kang, SH
Sanganeria, M
van Schravendijk, B
Mountsier, T
Citation: Sm. Merchant et al., Copper interconnects for semiconductor devices, JOM-J MIN, 53(6), 2001, pp. 43-48
Authors:
Babu, SV
Li, Y
Jindal, A
Citation: Sv. Babu et al., Chemical-mechanical planarization of Cu and Ta, JOM-J MIN, 53(6), 2001, pp. 50-52
Authors:
Sharma, RK
Kumar, A
Anthony, JM
Citation: Rk. Sharma et al., Advances in high-k dielectric gate materials for future ULSI devices, JOM-J MIN, 53(6), 2001, pp. 53-55
Authors:
Margolin, H
Citation: H. Margolin, Anisotropy, elastic stresses, and yielding, JOM-J MIN, 53(6), 2001, pp. 64-64
Authors:
Byko, M
Citation: M. Byko, Built to battle, robots test designers' mettle, JOM-J MIN, 53(5), 2001, pp. 12-14
Authors:
Stephens, RL
Citation: Rl. Stephens, Combustion processes in pyrometallurgy, JOM-J MIN, 53(5), 2001, pp. 15-15
Authors:
Jorgensen, FRA
Koh, PTL
Citation: Fra. Jorgensen et Ptl. Koh, Combustion in flash smelting furnaces, JOM-J MIN, 53(5), 2001, pp. 16-20
Authors:
Riley, MF
Kobayashi, H
Deneys, AC
Citation: Mf. Riley et al., Praxair's dilute oxygen combustion technology for pyrometallurgical applications, JOM-J MIN, 53(5), 2001, pp. 21-24
Authors:
Asaki, Z
Taniguchi, T
Hayashi, M
Citation: Z. Asaki et al., Kinetics of the reactions in the smelting furnace of the Mitsubishi process, JOM-J MIN, 53(5), 2001, pp. 25-27
Authors:
Edwards, L
Kvande, H
Citation: L. Edwards et H. Kvande, Inert anodes and other technology changes in the aluminum industry - The benefits, challenges, and impact on present technology, JOM-J MIN, 53(5), 2001, pp. 28-28