Authors:
RANGSTEN P
HEDLUND C
KATARDJIEV IV
BACKLUND Y
Citation: P. Rangsten et al., ETCH RATES OF CRYSTALLOGRAPHIC PLANES IN Z-CUT QUARTZ - EXPERIMENTS AND SIMULATION, Journal of micromechanics and microengineering, 8(1), 1998, pp. 1-6
Citation: M. Vangbo et Y. Backlund, A LATERAL SYMMETRICALLY BISTABLE BUCKLED BEAM, Journal of micromechanics and microengineering, 8(1), 1998, pp. 29-32
Citation: C. Strandman et Y. Backlund, PASSIVE AND FIXED ALIGNMENT OF DEVICES USING FLEXIBLE SILICON ELEMENTS FORMED BY SELECTIVE ETCHING, Journal of micromechanics and microengineering, 8(1), 1998, pp. 39-44
Citation: C. Strandman et Y. Backlund, BULK SILICON HOLDING STRUCTURES FOR MOUNTING OF OPTICAL FIBERS IN V-GROOVES, Journal of microelectromechanical systems, 6(1), 1997, pp. 35-40
Citation: Y. Backlund, MICROMECHANICS IN OPTICAL MICROSYSTEMS - WITH FOCUS ON TELECOM SYSTEMS, Journal of micromechanics and microengineering, 7(3), 1997, pp. 93-98
Authors:
HEDLUND C
STRANDMAN C
KATARDJIEV IV
BACKLUND Y
BERG S
BLOM HO
Citation: C. Hedlund et al., METHOD FOR THE DETERMINATION OF THE ANGULAR-DEPENDENCE DURING DRY-ETCHING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(5), 1996, pp. 3239-3243
Citation: M. Vangbo et Y. Backlund, PRECISE MASK ALIGNMENT TO THE CRYSTALLOGRAPHIC ORIENTATION OF SILICON-WAFERS USING WET ANISOTROPIC ETCHING, Journal of micromechanics and microengineering, 6(2), 1996, pp. 279-284
Citation: M. Vangbo et Y. Backlund, TERRACING OF (100)SI WITH ONE MASK AND ONE ETCHING STEP USING MISALIGNED V-GROOVES, Journal of micromechanics and microengineering, 6(1), 1996, pp. 39-41
Authors:
STRANDMAN C
ROSENGREN L
ELDERSTIG HGA
BACKLUND Y
Citation: C. Strandman et al., FABRICATION OF 45-DEGREES MIRRORS TOGETHER WITH WELL-DEFINED V-GROOVES USING WET ANISOTROPIC ETCHING OF SILICON, Journal of microelectromechanical systems, 4(4), 1995, pp. 213-219
Authors:
LJUNGBERG K
BACKLUND Y
SODERBARG A
BERGH M
ANDERSSON MO
BENGTSSON S
Citation: K. Ljungberg et al., THE EFFECTS OF HF CLEANING PRIOR TO SILICON-WAFER BONDING, Journal of the Electrochemical Society, 142(4), 1995, pp. 1297-1303