Authors:
Monsieur, F
Vincent, E
Roy, D
Bruyere, S
Pananakakis, G
Ghibaudo, G
Citation: F. Monsieur et al., Determination of dielectric breakdown Weibull distribution parameters confidence bounds for accurate ultrathin oxide reliability predictions, MICROEL REL, 41(9-10), 2001, pp. 1295-1300
Authors:
Ghibaudo, G
Clerc, R
Vincent, E
Bruyere, S
Autran, JL
Citation: G. Ghibaudo et al., Gate dielectrics for ultimate CMOS technologies - Limitations and alternative solutions, CR AC S IV, 1(7), 2000, pp. 911-927
Authors:
Ghibaudo, G
Bruyere, S
Devoivre, T
DeSalvo, B
Vincent, E
Citation: G. Ghibaudo et al., Improved method for the oxide thickness extraction in MOS structures with ultrathin gate dielectrics, IEEE SEMIC, 13(2), 2000, pp. 152-158
Authors:
Ghibaudo, G
Riess, P
Bruyere, S
DeSalvo, B
Jahan, C
Scarpa, A
Pananakakis, G
Vincent, E
Citation: G. Ghibaudo et al., Emerging oxide degradation mechanisms: Stress induced leakage current (SILC) and quasi-breakdown (QB), MICROEL ENG, 49(1-2), 1999, pp. 41-50
Authors:
Jahan, C
Bruyere, S
Ghibaudo, G
Vincent, E
Barla, K
Citation: C. Jahan et al., Model for the oxide thickness dependence of SILC generation based on anodehole injection process, MICROEL REL, 39(6-7), 1999, pp. 791-795
Citation: S. Bruyere et al., Temperature acceleration of breakdown and quasi-breakdown phenomena in ultra-thin oxides, MICROEL REL, 39(6-7), 1999, pp. 815-820
Citation: S. Bruyere et al., Stress-induced leakage current in very thin dielectric layers: some limitations to reliability extrapolation modeling, MICROEL REL, 39(2), 1999, pp. 209-214