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Results: 1-12 |
Results: 12
Mask blank fabrication, pattern transfer, and mounting distortion simulations for the 8-in. format SCALPEL mask
Authors: Dicks, G Engelstad, R Lovell, E Liddle, J
Citation: G. Dicks et al., Mask blank fabrication, pattern transfer, and mounting distortion simulations for the 8-in. format SCALPEL mask, MICROEL ENG, 57-8, 2001, pp. 433-438
Modeling mask fabrication and pattern transfer distortions for EPL stencilmasks
Authors: Reu, P Engelstad, R Lovell, E Magg, C Lercel, M
Citation: P. Reu et al., Modeling mask fabrication and pattern transfer distortions for EPL stencilmasks, MICROEL ENG, 57-8, 2001, pp. 467-473
Pattern transfer distortions in optical photomasks
Authors: Mikkelson, A Engelstad, R Lovell, E
Citation: A. Mikkelson et al., Pattern transfer distortions in optical photomasks, MICROEL ENG, 57-8, 2001, pp. 489-495
Critical dimension issues for 200 mm electron projection masks
Authors: Resnick, DJ Nordquist, K Dauksher, WJ Ainley, E Lu, B Mangat, P Weisbrod, E Martin, C Chang, J Englestad, R Lovell, E Ivin, V
Citation: Dj. Resnick et al., Critical dimension issues for 200 mm electron projection masks, JPN J A P 1, 39(12B), 2000, pp. 6874-6880
Modeling pattern transfer in ion-beam lithography masks
Authors: Frisque, G Tejeda, R Engelstad, R Lovell, E
Citation: G. Frisque et al., Modeling pattern transfer in ion-beam lithography masks, MICROEL ENG, 53(1-4), 2000, pp. 623-626
Comparison of silicon stencil mask distortion measurements with finite element analysis
Authors: Ehrmann, A Struck, T Chalupka, A Haugeneder, E Loschner, H Butschke, J Irmscher, M Letzkus, F Springer, R Degen, A Rangelow, IW Shi, F Sossna, E Volland, B Engelstad, R Lovell, E Tejeda, R
Citation: A. Ehrmann et al., Comparison of silicon stencil mask distortion measurements with finite element analysis, J VAC SCI B, 17(6), 1999, pp. 3107-3111
Modeling and simulation of membrane distortions in Next Generation Lithography (NGL) masks
Authors: Engelstad, R Lovell, E Dicks, G Fisher, A Tejeda, R
Citation: R. Engelstad et al., Modeling and simulation of membrane distortions in Next Generation Lithography (NGL) masks, MICROEL ENG, 46(1-4), 1999, pp. 23-26
Mask membrane distortions due to pattern transfer for electron-beam lithography (SCALPEL) masks
Authors: Dicks, G Engelstad, R Lovell, E Liddle, J
Citation: G. Dicks et al., Mask membrane distortions due to pattern transfer for electron-beam lithography (SCALPEL) masks, MICROEL ENG, 46(1-4), 1999, pp. 259-262
Stress relief structures for ion-beam projection lithography masks
Authors: Tejeda, R Engelstad, R Lovell, E Haugeneder, E Loschner, H
Citation: R. Tejeda et al., Stress relief structures for ion-beam projection lithography masks, MICROEL ENG, 46(1-4), 1999, pp. 481-484
Finite element simulation of ion-beam lithography mask fabrication
Authors: Tejeda, R Frisque, G Engelstad, R Lovell, E Haugeneder, E Loschner, H
Citation: R. Tejeda et al., Finite element simulation of ion-beam lithography mask fabrication, MICROEL ENG, 46(1-4), 1999, pp. 485-488
p-n junction-based wafer flow process for stencil mask fabrication
Authors: Rangelow, IW Shi, F Volland, B Sossna, E Petrashenko, A Hudek, P Sunyk, R Butschke, J Letzkus, F Springer, R Ehrmann, A Gross, G Kaesmaier, R Oelmann, A Struck, T Unger, G Chalupka, A Haugeneder, E Lammer, G Loschner, H Tejeda, R Lovell, E Engelstad, R
Citation: Iw. Rangelow et al., p-n junction-based wafer flow process for stencil mask fabrication, J VAC SCI B, 16(6), 1998, pp. 3592-3598
Optimization of the temperature distribution across stencil mask membranesunder ion beam exposure
Authors: Kim, B Engelstad, R Lovell, E Chalupka, A Haugeneder, E Lammer, G Loschner, H Lutz, J Stengl, G
Citation: B. Kim et al., Optimization of the temperature distribution across stencil mask membranesunder ion beam exposure, J VAC SCI B, 16(6), 1998, pp. 3602-3605
Risultati: 1-12 |