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Results: 1-21 |
Results: 21
Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
Authors: Carchon, G Vaesen, K Brebels, S De Raedt, W Beyne, E Nauwelaers, B
Citation: G. Carchon et al., Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits, IEEE T COMP, 24(3), 2001, pp. 510-519
Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model
Authors: Carchon, G De Raedt, W Nauwelaers, B
Citation: G. Carchon et al., Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model, IEE P-MIC A, 148(4), 2001, pp. 227-232
On the mutual capacitance and inductance of a shielded interconnect four-line system
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., On the mutual capacitance and inductance of a shielded interconnect four-line system, J MICROM M, 11(3), 2001, pp. 161-164
New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate, J MICROM M, 11(3), 2001, pp. 283-286
Distributed inductance and resistance per-unit-length formulas for VLSI interconnects on silicon substrate
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., Distributed inductance and resistance per-unit-length formulas for VLSI interconnects on silicon substrate, MICROW OPT, 30(5), 2001, pp. 302-304
On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors, MICROW OPT, 30(5), 2001, pp. 335-339
The influence of the bumping height on the performance of flip-chipped CPWLange couplers
Authors: Carchon, G Nauwelaers, B
Citation: G. Carchon et B. Nauwelaers, The influence of the bumping height on the performance of flip-chipped CPWLange couplers, MICROW OPT, 29(4), 2001, pp. 263-267
Multi-layer thin-film MCM-D for the integration of high performance wireless front-end systems
Authors: Carchon, G Nauwelaers, B Pieters, P Vaesen, K De Raedt, W Beyne, E
Citation: G. Carchon et al., Multi-layer thin-film MCM-D for the integration of high performance wireless front-end systems, MICROWAVE J, 44(2), 2001, pp. 96
Simulations and measurements of capacitance in dielectric stacks and consequences for integration
Authors: De Roest, D Donaton, RA Stucchi, M Maex, K Nauwelaers, B
Citation: D. De Roest et al., Simulations and measurements of capacitance in dielectric stacks and consequences for integration, MICROEL ENG, 55(1-4), 2001, pp. 29-35
Fast and accurate analysis of the multiconductor interconnects
Authors: Ymeri, H Nauwelaers, B Maex, K De Roest, D
Citation: H. Ymeri et al., Fast and accurate analysis of the multiconductor interconnects, MICROEL ENG, 55(1-4), 2001, pp. 37-42
Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., Frequency-dependent mutual resistance and inductance formulas for coupled IC interconnects on an Si-SiO2 substrate, INTEGRATION, 30(2), 2001, pp. 133-141
On the modelling of multiconductor multilayer systems for interconnect applications
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., On the modelling of multiconductor multilayer systems for interconnect applications, MICROELEC J, 32(4), 2001, pp. 351-355
Integration of CPW quadrature couplers in multilayer thin-film MCM-D
Authors: Carchon, G De Raedt, W Nauwelaers, B
Citation: G. Carchon et al., Integration of CPW quadrature couplers in multilayer thin-film MCM-D, IEEE MICR T, 49(10), 2001, pp. 1770-1776
Simple and accurate expressions for distributed mutual inductance and resistance of semiconducting interconnects
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., Simple and accurate expressions for distributed mutual inductance and resistance of semiconducting interconnects, APPL PHYS L, 79(9), 2001, pp. 1378-1380
On the two-dimensional capacitance calculation of multiconductor multilayered interconnects
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., On the two-dimensional capacitance calculation of multiconductor multilayered interconnects, ANN TELECOM, 56(9-10), 2001, pp. 550-559
Development of a frequency-domain simulation tool and nonlinear device model from vectorial large-signal measurements
Authors: Schreurs, D Rutkowski, J Beyer, A Nauwelaers, B
Citation: D. Schreurs et al., Development of a frequency-domain simulation tool and nonlinear device model from vectorial large-signal measurements, INT J RF MI, 10(1), 2000, pp. 63-72
HEMT parameter extraction combining optimization and direct parasitic extraction
Authors: Vandenberghe, S Schreurs, D Van der Zanden, K Carchon, G Nauwelaers, B De Raedt, W
Citation: S. Vandenberghe et al., HEMT parameter extraction combining optimization and direct parasitic extraction, INT J RF MI, 10(1), 2000, pp. 81-90
A new approach for the calculation of line capacitances of two-layer IC interconnects
Authors: Ymeri, H Nauwelaers, B Maex, K De Roest, D
Citation: H. Ymeri et al., A new approach for the calculation of line capacitances of two-layer IC interconnects, MICROW OPT, 27(5), 2000, pp. 297-302
Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method
Authors: Ymeri, H Nauwelaers, B Maex, K
Citation: H. Ymeri et al., Computation of capacitance matrix for integrated circuit interconnects using semi-analytic Green's function method, INTEGRATION, 30(1), 2000, pp. 55-63
Power and noise limitations of active circulators
Authors: Carchon, G Nauwelaers, B
Citation: G. Carchon et B. Nauwelaers, Power and noise limitations of active circulators, IEEE MICR T, 48(2), 2000, pp. 316-319
Characterising differences between measurement and calibration wafer in probe-tip calibrations
Authors: Carchon, G Nauwelaers, B De Raedt, W Schreurs, D Vandenberghe, S
Citation: G. Carchon et al., Characterising differences between measurement and calibration wafer in probe-tip calibrations, ELECTR LETT, 35(13), 1999, pp. 1087-1088
Risultati: 1-21 |