Authors:
SAFONOVA OV
RUMYANTSEVA MN
LABEAU M
GASKOV AM
Citation: Ov. Safonova et al., EFFECT OF DOPING METALS ON THE KINETICS OF INTERACTION OF SNO2 THIN-FILMS WITH OXYGEN, Journal of materials chemistry (Print), 8(7), 1998, pp. 1577-1581
Authors:
VASILIEV RB
RUMYANTSEVA MN
YAKOVLEV NV
GASKOV AM
Citation: Rb. Vasiliev et al., CUO SNO2 THIN-FILM HETEROSTRUCTURES AS CHEMICAL SENSORS TO H2S/, Sensors and actuators. B, Chemical, 50(3), 1998, pp. 186-193
Authors:
AKIMOV BA
ALBUL AV
GASKOV AM
ILIN VY
RUMYANTSEVA MN
RYABOVA LI
LABEAU M
Citation: Ba. Akimov et al., ELECTRICAL-CONDUCTIVITY OF POLYCRYSTALLINE SNO2(CU) FILMS AND THEIR SENSITIVITY TO HYDROGEN-SULFIDE, Semiconductors, 31(4), 1997, pp. 335-339
Authors:
KUDRYAVTSEVA SM
VERTEGEL AA
KALININ SV
OLEYNIKOV NN
RYABOVA LI
MESHKOV LL
NESTERENKO SN
RUMYANTSEVA MN
GASKOV AM
Citation: Sm. Kudryavtseva et al., EFFECT OF MICROSTRUCTURE ON THE STABILITY OF NANOCRYSTALLINE TIN DIOXIDE CERAMICS, Journal of materials chemistry, 7(11), 1997, pp. 2269-2272
Authors:
RUMYANTSEVA MN
GASKOV AM
RYABOVA LI
SENATEUR JP
CHENEVIER B
LABEAU M
Citation: Mn. Rumyantseva et al., PYROSOL SPRAYING DEPOSITION OF COPPER-DOPED AND NICKEL-DOPED TIN OXIDE-FILMS, Materials science & engineering. B, Solid-state materials for advanced technology, 41(3), 1996, pp. 333-338
Authors:
RUMYANTSEVA MN
LABEAU M
SENATEUR JP
DELABOUGLISE G
BOULOVA MN
GASKOV AM
Citation: Mn. Rumyantseva et al., INFLUENCE OF COPPER ON SENSOR PROPERTIES OF TIN DIOXIDE FILMS IN H2S, Materials science & engineering. B, Solid-state materials for advanced technology, 41(2), 1996, pp. 228-234
Authors:
GASKOV AM
RYABKOVA LI
LABEAU M
DELABOUGLISE Z
RUMYANTSEVA MN
KUZNETSOVA TA
BULOVA MN
Citation: Am. Gaskov et al., COPPER EFFECT ON THE SENSOR PROPERTIES OF SNO2 POLYCRYSTALLINE FILMS, Zurnal neorganiceskoj himii, 41(6), 1996, pp. 989-997
Authors:
BELYANSKY MP
GASKOV AM
RUMYANTSEVA MN
STRELKOV AV
Citation: Mp. Belyansky et al., INFLUENCE OF THE BOUNDARY ON THE INTERDIFFUSION IN HETEROSTRUCTURES, Materials science & engineering. B, Solid-state materials for advanced technology, 26(2-3), 1994, pp. 147-149