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Results: 1-8 |
Results: 8
Etching characteristics and mechanical properties of a-SiC : H thin films
Authors: Schmid, U Eickhoff, M Richter, C Krotz, G Schmitt-Landsiedel, D
Citation: U. Schmid et al., Etching characteristics and mechanical properties of a-SiC : H thin films, SENS ACTU-A, 94(1-2), 2001, pp. 87-94
Low-frequency noise of integrated poly-silicon resistors
Authors: Brederlow, R Weber, W Dahl, C Schmitt-Landsiedel, D Thewes, R
Citation: R. Brederlow et al., Low-frequency noise of integrated poly-silicon resistors, IEEE DEVICE, 48(6), 2001, pp. 1180-1187
A 1.8-V MOSFET-only Sigma Delta modulator using substrate biased depletion-mode MOS capacitors in series compensation
Authors: Tille, T Sauerbrey, J Schmitt-Landsiedel, D
Citation: T. Tille et al., A 1.8-V MOSFET-only Sigma Delta modulator using substrate biased depletion-mode MOS capacitors in series compensation, IEEE J SOLI, 36(7), 2001, pp. 1041-1047
Analysis and compensation of the bitline multiplexer in SRAM current senseamplifiers
Authors: Wicht, B Paul, S Schmitt-Landsiedel, D
Citation: B. Wicht et al., Analysis and compensation of the bitline multiplexer in SRAM current senseamplifiers, IEEE J SOLI, 36(11), 2001, pp. 1745-1755
Scaling properties and electromigration resistance of sputtered Ag metallization lines
Authors: Hauder, M Gstottner, J Hansch, W Schmitt-Landsiedel, D
Citation: M. Hauder et al., Scaling properties and electromigration resistance of sputtered Ag metallization lines, APPL PHYS L, 78(6), 2001, pp. 838-840
Effect of parameter variations at chip and wafer level on clock skews
Authors: Sauter, S Schmitt-Landsiedel, D Thewes, R Weber, W
Citation: S. Sauter et al., Effect of parameter variations at chip and wafer level on clock skews, IEEE SEMIC, 13(4), 2000, pp. 395-400
Yield and reliability analysis of digital standard cells with resistive defects
Authors: Huber, M Nirschl, T Gstottner, J Heinitz, M Zanon, T Maly, W Schmitt-Landsiedel, D
Citation: M. Huber et al., Yield and reliability analysis of digital standard cells with resistive defects, MICROEL REL, 40(8-10), 2000, pp. 1635-1640
Improved SRAM failure diagnosis for process monitoring via current signature analysis
Authors: Schienle, M Zanon, T Schmitt-Landsiedel, D
Citation: M. Schienle et al., Improved SRAM failure diagnosis for process monitoring via current signature analysis, MICROEL REL, 39(6-7), 1999, pp. 1009-1014
Risultati: 1-8 |