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Results: 51-75/78
Authors:
Wang, ZP
Tan, YM
Schreiber, CM
Feigenbaum, H
Shi, ZF
Wei, J
Citation: Zp. Wang et al., Low cost Chip-on-Dot flip chip technique for unbumped die, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 297-301
Authors:
Quach, H
Ang, SS
Barlow, F
Elshabini, A
Olejniczak, K
Malshe, A
Brown, WD
Citation: H. Quach et al., A flip-chip power electronics packaging technology on a flexible polymericsubstrates, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 302-307
Authors:
Park, YJ
Kang, KA
Rho, KS
Om, SH
Oh, CM
Yoon, SE
Lee, SO
Park, HW
Lee, JH
Citation: Yj. Park et al., Design and development challenges for micro chip carrier, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 308-314
Authors:
Schulz-Harder, J
Citation: J. Schulz-harder, DBC substrates as a base for power MCM's, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 315-320
Authors:
Gan, EKW
Zheng, HY
Lim, GC
Citation: Ekw. Gan et al., Laser drilling of micro-vias in PCB substrates, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 321-326
Authors:
Roeck, M
Hunt, I
Citation: M. Roeck et I. Hunt, Isotropically conductive adhesives for electronic manufacture of flexible printed circuit boards, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 327-334
Copper flip chip bump interconnect technology for microwave subsystems including RF characterization
Authors:
Wong, A
Linton, D
Citation: A. Wong et D. Linton, Copper flip chip bump interconnect technology for microwave subsystems including RF characterization, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 335-338
Authors:
Zak, T
Ducrot, M
Xavier, C
Drissi, M
Citation: T. Zak et al., An experimental procedure to derive reliable IBIS models, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 339-344
Authors:
Morsey, J
Coperich, K
Okhmatovski, V
Cangellaris, AC
Ruehli, A
Citation: J. Morsey et al., A new broadband transmission line model for accurate simulation of dispersive interconnects, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 345-351
Authors:
Lu, ACW
Xie, DJ
Shi, ZF
Ryu, W
Citation: Acw. Lu et al., Electrical and thermal modelling of QFN packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 352-356
Authors:
Nomura, Y
Tomiyama, T
Tanaka, T
Inada, TI
Sumiya, K
Citation: Y. Nomura et al., Material system for high performance DRAM-CSP, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 357-360
Authors:
Ito, S
Kuroyanagi, A
Mizutani, M
Noro, H
Citation: S. Ito et al., Design of encapsulating materials for advanced area bump packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 361-366
Authors:
Matsumoto, S
Jin, XZ
Fukushima, T
Miyamura, M
Itatani, H
Citation: S. Matsumoto et al., Applications of newly developed positive photosensitive block co-polyimides to CSPs, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 367-372
Authors:
Wang, TB
Fu, Y
Becker, M
Liu, J
Citation: Tb. Wang et al., Heating and reliability characteristics of electrically conductive adhesives using variable frequency microwave cure, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 373-377
Authors:
Paik, KW
Yim, MJ
Jeon, YD
Citation: Kw. Paik et al., Flip chip assembly on organic boards using anisotropic conductive adhesives(ACAs) and nickel/gold bumps, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 378-384
Authors:
Pang, HLJ
Ang, KH
Shi, XQ
Wang, ZP
Citation: Hlj. Pang et al., Methodology for a highly accelerated solder joint reliability test, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 385-390
Authors:
Zhang, LL
Chee, SS
Maheshwari, A
Funcell, A
Citation: Ll. Zhang et al., Experimental and finite element analysis of cavity down BGA package solderjoint reliability, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 391-397
Authors:
Shi, XQ
Yang, QJ
Wang, ZP
Pang, HLJ
Zhou, W
Citation: Xq. Shi et al., Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 398-405
Authors:
Shin, CK
Huh, JY
Citation: Ck. Shin et Jy. Huh, Effect of Cu-containing solders on the critical IMC thickness for the shear strength of BGA solder joints, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 406-411
Authors:
Albrecht, HJ
Hyslop, DC
Jendrny, J
Muller, WH
Ng, KMW
Tan, KH
Citation: Hj. Albrecht et al., Modelling the reliability of high-density substrates and associated microelectronic components, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 412-418
Authors:
Ng, EYK
Poh, ST
Chai, JCK
Citation: Eyk. Ng et al., Modelling of pressure-driven liquid flows in conjugate rectangular microchannel with electric double layer effects, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 419-424
Authors:
Zaghdoudi, MC
Teytu, A
Citation: Mc. Zaghdoudi et A. Teytu, Use of heat pipes for avionics cooling, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 425-430
Authors:
Wong, CW
Seetharamu, KN
Alimuddin, Z
Hassan, AY
Goh, TJ
Citation: Cw. Wong et al., Three-dimensional analysis of an enhanced cooling system for electronic packaging, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 431-437
Authors:
Low, KW
Yap, C
Citation: Kw. Low et C. Yap, Heat transfer coefficient for flat and ribbed surfaces with interrupted heating, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 438-444
Authors:
Quadir, GA
Leong, CB
Krishnan, GM
Seetharamu, KN
Citation: Ga. Quadir et al., Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 445-451