Authors:
SAITOH Y
TAKEUCHI H
MANDAI M
KANAZAWA H
YAMANAKA J
MIYAHARA S
KAMIYA M
FUJITA Y
HIGASHI Y
IKEDA H
IKEDA M
KOIKE S
MATSUDA T
OZAKI H
TANAKA M
TSUBOYAMA T
AVRILLON S
OKUNO S
HABA J
HANAI H
MORI S
YUSA K
FUKUNAGA C
Citation: Y. Saitoh et al., DEVELOPMENT OF NEW ASSEMBLY TECHNIQUES FOR A SILICON MICRO-VERTEX DETECTOR UNIT USING THE FLIP-CHIP BONDING METHOD, Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 342(1), 1994, pp. 298-301