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Results:
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Results: 24
Authors:
Jaing, TH
Lin, KL
Chiu, CH
Lo, WC
Wu, PL
Citation: Th. Jaing et al., Acute disseminated encephalomyelitis in autoimmune hemolytic anemia, PED NEUROL, 24(4), 2001, pp. 303-305
Authors:
Lin, KL
Hsu, HM
Citation: Kl. Lin et Hm. Hsu, Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact, J ELEC MAT, 30(9), 2001, pp. 1068-1072
Authors:
Wang, KS
Chiang, KY
Lin, KL
Sun, CJ
Citation: Ks. Wang et al., Effects of a water-extraction process on heavy metal behavior in municipalsolid waste incinerator fly ash, HYDROMETALL, 62(2), 2001, pp. 73-81
Authors:
Lin, KL
Chang, YL
Huang, CC
Li, FI
Hsu, JC
Citation: Kl. Lin et al., Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu inthe presence of additives, APPL SURF S, 181(1-2), 2001, pp. 166-172
Authors:
Wang, KS
Chiang, KY
Tsai, CC
Sun, CJ
Tsai, CC
Lin, KL
Citation: Ks. Wang et al., The effects of FeCl3 on the distribution of the heavy metals Cd, Cu, Cr, and Zn in a simulated multimetal incineration system, ENVIRON INT, 26(4), 2001, pp. 257-263
Authors:
Wang, KS
Lin, KL
Huang, ZQ
Citation: Ks. Wang et al., Hydraulic activity of municipal solid waste incinerator fly-ash-slag-blended eco-cement, CEM CONCR R, 31(1), 2001, pp. 97-103
Authors:
Lin, KL
Hsu, KT
Citation: Kl. Lin et Kt. Hsu, Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bumpon Si, IEEE T COMP, 23(4), 2000, pp. 657-660
Authors:
Lin, KL
Yao, S
Citation: Kl. Lin et S. Yao, Solder thickness variation with respect to soldering parameters, IEEE T COMP, 23(4), 2000, pp. 661-664
Authors:
Lin, KL
Chen, JW
Citation: Kl. Lin et Jw. Chen, Wave soldering bumping process incorporating electroless nickel UBM, IEEE T COMP, 23(1), 2000, pp. 143-150
Authors:
Lin, KL
Wang, JT
Fang, LS
Citation: Kl. Lin et al., Participation of glycoproteins on zooxanthellal cell walls in the establishment of a symbiotic relationship with the sea anemone, Aiptasia pulchella, ZOOL STUD, 39(3), 2000, pp. 172-178
Authors:
Lin, KL
Wang, HS
Chen, ST
Ro, LS
Citation: Kl. Lin et al., gamma-sarcoglycan deficiency muscular dystrophy in two adults, J FORMOS ME, 99(10), 2000, pp. 789-791
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
Authors:
Chen, CJ
Lin, KL
Citation: Cj. Chen et Kl. Lin, The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow, J ELEC MAT, 29(8), 2000, pp. 1007-1014
Authors:
Lin, KL
Hsu, KT
Citation: Kl. Lin et Kt. Hsu, Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths, PLAT SURF F, 87(3), 2000, pp. 86-89
Authors:
Chen, CJ
Lin, KL
Citation: Cj. Chen et Kl. Lin, Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum, THIN SOL FI, 370(1-2), 2000, pp. 106-113
Authors:
Lin, KL
Chen, CL
Citation: Kl. Lin et Cl. Chen, Intermittent electroless nickel deposition in a fine trench flip chip bumppad, J ELCHEM SO, 147(7), 2000, pp. 2604-2606
Authors:
Lin, SC
Lin, KL
Chiu, HC
Lin, SY
Citation: Sc. Lin et al., Enhanced protein renaturation by temperature-responsive polymers, BIOTECH BIO, 67(5), 2000, pp. 505-512
Authors:
Lin, KL
Liu, YC
Citation: Kl. Lin et Yc. Liu, Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps, IEEE T AD P, 22(4), 1999, pp. 568-574
Authors:
Lin, KL
Liu, YC
Citation: Kl. Lin et Yc. Liu, Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps, IEEE T AD P, 22(4), 1999, pp. 575-579
Authors:
Lin, KL
Liu, YT
Citation: Kl. Lin et Yt. Liu, Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy, IEEE T AD P, 22(4), 1999, pp. 580-585
Authors:
Chang, DK
Cheng, SF
Trivedi, VD
Lin, KL
Citation: Dk. Chang et al., Proline affects oligomerization of a coiled coil by inducing a kink in a long helix, J STRUCT B, 128(3), 1999, pp. 270-279
Authors:
Chen, CY
Lin, KL
Wang, HS
Lui, TN
Citation: Cy. Chen et al., Dermoid cyst with dermal sinus tract complicated with spinal subdural abscess, PED NEUROL, 20(2), 1999, pp. 157-160
Authors:
Lin, KL
Chen, CY
Hsu, HH
Kao, PF
Huang, MJ
Wang, HS
Citation: Kl. Lin et al., Ectopic ACTH syndrome due to thymic carcinoid tumor in a girl, J PED END M, 12(4), 1999, pp. 573-578
Authors:
Chang, LY
Lin, TY
Hsu, KH
Huang, YC
Lin, KL
Hsueh, C
Shih, SR
Ning, HC
Hwang, MS
Wang, HS
Lee, CY
Citation: Ly. Chang et al., Clinical features and risk factors of pulmonary oedema after enterovirus-71-related hand, foot, and mouth disease, LANCET, 354(9191), 1999, pp. 1682-1686
Authors:
Chen, CJ
Lin, KL
Citation: Cj. Chen et Kl. Lin, The deposition and crystallization behaviors of electroless Ni-Cu-P deposits, J ELCHEM SO, 146(1), 1999, pp. 137-140
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