AAAAAA

   
Results: 1-19 |
Results: 19
CVD PROCESS FOR COPPER INTERCONNECTION
Authors: MARCADAL C RICHARD E TORRES J PALLEAU J MADAR R
Citation: C. Marcadal et al., CVD PROCESS FOR COPPER INTERCONNECTION, Microelectronic engineering, 37-8(1-4), 1997, pp. 97-103
OMCVD TIN DIFFUSION BARRIER FOR COPPER CONTACT AND VIA INTERCONNECTS STRUCTURES/
Authors: MARCADAL C RICHARD E TORRES J PALLEAU J ULMER L PERROUD L PIAGUET J ROLLAND G
Citation: C. Marcadal et al., OMCVD TIN DIFFUSION BARRIER FOR COPPER CONTACT AND VIA INTERCONNECTS STRUCTURES/, Microelectronic engineering, 37-8(1-4), 1997, pp. 197-203
CLEANING AFTER SILICON-OXIDE CMP
Authors: TARDIF F CONSTANT I LARDIN T DEMOLLIENS O FAYOLLE M GOBIL Y PALLEAU J TORRES J
Citation: F. Tardif et al., CLEANING AFTER SILICON-OXIDE CMP, Microelectronic engineering, 37-8(1-4), 1997, pp. 285-291
CU-CVD PROCESS OPTIMIZED IN A CLUSTER EQUIPMENT FOR IC MANUFACTURING
Authors: MARCADAL C RICHARD E MERMET JL TORRES J PALLEAU J ALAUX B BAKLI M
Citation: C. Marcadal et al., CU-CVD PROCESS OPTIMIZED IN A CLUSTER EQUIPMENT FOR IC MANUFACTURING, Microelectronic engineering, 33(1-4), 1997, pp. 3-13
COPPER LPCVD FOR ADVANCED TECHNOLOGY
Authors: BOURHILA N TORRES J PALLEAU J BERNARD C MADAR R
Citation: N. Bourhila et al., COPPER LPCVD FOR ADVANCED TECHNOLOGY, Microelectronic engineering, 33(1-4), 1997, pp. 25-30
MECHANICAL RELIABILITY OF CVD-COPPER THIN-FILMS
Authors: JONGSTE JF LOKKER JP JANSSEN GCAM RADELAAR S TORRES J PALLEAU J
Citation: Jf. Jongste et al., MECHANICAL RELIABILITY OF CVD-COPPER THIN-FILMS, Microelectronic engineering, 33(1-4), 1997, pp. 39-46
WET CLEANINGS ADAPTED TO BACK-END PROCESSES
Authors: TARDIF F PALLEAU J LARDIN T DEMOLLIENS O VINCENT A TORRES J
Citation: F. Tardif et al., WET CLEANINGS ADAPTED TO BACK-END PROCESSES, Microelectronic engineering, 33(1-4), 1997, pp. 195-201
COPPER CONTAMINATION EFFECTS IN 0.5 MU-M BICMOS TECHNOLOGY
Authors: GRAVIER T BRAUD F TORRES J PALLEAU J CHANTRE A KIRTSCH J
Citation: T. Gravier et al., COPPER CONTAMINATION EFFECTS IN 0.5 MU-M BICMOS TECHNOLOGY, Microelectronic engineering, 33(1-4), 1997, pp. 211-216
ULTRA-THIN DIFFUSION-BARRIERS FOR CU INTERCONNECTIONS AT THE GIGABIT GENERATION AND BEYOND
Authors: BRAUD F TORRES J PALLEAU J MERMET JL MARCADAL C RICHARD E
Citation: F. Braud et al., ULTRA-THIN DIFFUSION-BARRIERS FOR CU INTERCONNECTIONS AT THE GIGABIT GENERATION AND BEYOND, Microelectronic engineering, 33(1-4), 1997, pp. 293-300
STUDY OF THE THERMAL-STABILITY AT THE CU SIOF INTERFACE/
Authors: LABIADH A BRAUD F TORRES J PALLEAU J PASSEMARD G PIRES F DUPUY JC DUBOIS C GAUTIER B
Citation: A. Labiadh et al., STUDY OF THE THERMAL-STABILITY AT THE CU SIOF INTERFACE/, Microelectronic engineering, 33(1-4), 1997, pp. 369-375
ELECTROMIGRATION OF INTERCONNECTS OF A TIN CU/TIN/TI STRUCTURE/
Authors: BRAUD F TARTAVEL G PALLEAU J TORRES J PERSICO A REIMBOLD G
Citation: F. Braud et al., ELECTROMIGRATION OF INTERCONNECTS OF A TIN CU/TIN/TI STRUCTURE/, Quality and reliability engineering international, 12(4), 1996, pp. 305-308
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN
Authors: MOUCHE MJ MERMET JL PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Mj. Mouche et al., PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN, Applied surface science, 91(1-4), 1995, pp. 129-133
THERMODYNAMIC AND EXPERIMENTAL-STUDY OF CU-LPCVD BY REDUCTION OF COPPER CHLORIDE
Authors: BOURHILA N THOMAS N PALLEAU J TORRES J BERNARD C MADAR R
Citation: N. Bourhila et al., THERMODYNAMIC AND EXPERIMENTAL-STUDY OF CU-LPCVD BY REDUCTION OF COPPER CHLORIDE, Applied surface science, 91(1-4), 1995, pp. 175-181
TI-DIFFUSION BARRIER IN CU-BASED METALLIZATION
Authors: BRAUD F TORRES J PALLEAU J MERMET JL MOUCHE MJ
Citation: F. Braud et al., TI-DIFFUSION BARRIER IN CU-BASED METALLIZATION, Applied surface science, 91(1-4), 1995, pp. 251-256
GROWTH, PHYSICAL-PROPERTIES, AND ADHESION OF COPPER-POLYPHENYLQUINOXALINE INTERFACES
Authors: PIREAUX JJ GREGOIRE C BELLARD L CROS A TORRES J PALLEAU J TEMPLIER F NECHSTCHEIN J LAZARE S
Citation: Jj. Pireaux et al., GROWTH, PHYSICAL-PROPERTIES, AND ADHESION OF COPPER-POLYPHENYLQUINOXALINE INTERFACES, Journal of applied physics, 76(2), 1994, pp. 1244-1255
INTERACTION AT THE METAL-POLYPHENYLQUINOX ALINE INTERFACE
Authors: CROS A BELLARD L PALMINO F TORRES J PALLEAU J CLARYS C PIREAUX JJ GREGOIRE C
Citation: A. Cros et al., INTERACTION AT THE METAL-POLYPHENYLQUINOX ALINE INTERFACE, Le Vide, (268), 1993, pp. 91-91
HIGH-DENSITY MULTILAYER INTERCONNECT MODULE FABRICATION BY LIFT-OFF TECHNIQUE
Authors: PALLEAU J JOURDAIN D OBERLIN JC ALAIMO M ARGOUD G AUBERT D BEUDON M BOUZID MJ LAVIALE D TEMPLIER F TORRES J
Citation: J. Palleau et al., HIGH-DENSITY MULTILAYER INTERCONNECT MODULE FABRICATION BY LIFT-OFF TECHNIQUE, Journal de physique. III, 3(4), 1993, pp. 793-804
Risultati: 1-19 |