Authors:
MARCADAL C
RICHARD E
TORRES J
PALLEAU J
ULMER L
PERROUD L
PIAGUET J
ROLLAND G
Citation: C. Marcadal et al., OMCVD TIN DIFFUSION BARRIER FOR COPPER CONTACT AND VIA INTERCONNECTS STRUCTURES/, Microelectronic engineering, 37-8(1-4), 1997, pp. 197-203
Authors:
MARCADAL C
RICHARD E
MERMET JL
TORRES J
PALLEAU J
ALAUX B
BAKLI M
Citation: C. Marcadal et al., CU-CVD PROCESS OPTIMIZED IN A CLUSTER EQUIPMENT FOR IC MANUFACTURING, Microelectronic engineering, 33(1-4), 1997, pp. 3-13
Authors:
BRAUD F
TORRES J
PALLEAU J
MERMET JL
MARCADAL C
RICHARD E
Citation: F. Braud et al., ULTRA-THIN DIFFUSION-BARRIERS FOR CU INTERCONNECTIONS AT THE GIGABIT GENERATION AND BEYOND, Microelectronic engineering, 33(1-4), 1997, pp. 293-300
Authors:
BRAUD F
TARTAVEL G
PALLEAU J
TORRES J
PERSICO A
REIMBOLD G
Citation: F. Braud et al., ELECTROMIGRATION OF INTERCONNECTS OF A TIN CU/TIN/TI STRUCTURE/, Quality and reliability engineering international, 12(4), 1996, pp. 305-308
Authors:
MERMET JL
MOUCHE MJ
PIRES F
RICHARD E
TORRES J
PALLEAU J
BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
Authors:
MERMET JL
MOUCHE MJ
PIRES F
RICHARD E
TORRES J
PALLEAU J
BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
Authors:
MOUCHE MJ
MERMET JL
PIRES F
RICHARD E
TORRES J
PALLEAU J
BRAUD F
Citation: Mj. Mouche et al., PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN, Applied surface science, 91(1-4), 1995, pp. 129-133
Authors:
BOURHILA N
THOMAS N
PALLEAU J
TORRES J
BERNARD C
MADAR R
Citation: N. Bourhila et al., THERMODYNAMIC AND EXPERIMENTAL-STUDY OF CU-LPCVD BY REDUCTION OF COPPER CHLORIDE, Applied surface science, 91(1-4), 1995, pp. 175-181
Authors:
PIREAUX JJ
GREGOIRE C
BELLARD L
CROS A
TORRES J
PALLEAU J
TEMPLIER F
NECHSTCHEIN J
LAZARE S
Citation: Jj. Pireaux et al., GROWTH, PHYSICAL-PROPERTIES, AND ADHESION OF COPPER-POLYPHENYLQUINOXALINE INTERFACES, Journal of applied physics, 76(2), 1994, pp. 1244-1255
Authors:
PALLEAU J
JOURDAIN D
OBERLIN JC
ALAIMO M
ARGOUD G
AUBERT D
BEUDON M
BOUZID MJ
LAVIALE D
TEMPLIER F
TORRES J
Citation: J. Palleau et al., HIGH-DENSITY MULTILAYER INTERCONNECT MODULE FABRICATION BY LIFT-OFF TECHNIQUE, Journal de physique. III, 3(4), 1993, pp. 793-804