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Results: 1-25/26
Authors:
LEE SY
KIM DW
RHA SK
PARK CO
PARK HH
Citation: Sy. Lee et al., REFLOW OF COPPER IN AN OXYGEN AMBIENT, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2902-2905
Authors:
RHA SK
LEE SY
LEE WJ
HWANG YS
PARK CO
KIM DW
LEE YS
WHANG CN
Citation: Sk. Rha et al., CHARACTERIZATION OF TIN BARRIERS AGAINST CU DIFFUSION BY CAPACITANCE-VOLTAGE MEASUREMENT, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(4), 1998, pp. 2019-2025
Authors:
KIM DI
CHOI SH
PARK CO
O B
Citation: Di. Kim et al., LUMINESCENCE CHARACTERISTICS OF ZNS-CU THIN-FILM ELECTROLUMINESCENT DEVICES FABRICATED, Journal of materials science. Materials in electronics, 9(1), 1998, pp. 31-34
Authors:
PARK CO
Citation: Co. Park, THE EFFECTS OF METHYLPREDNISOLONE ON PREVENTION OF BRAIN EDEMA AFTER EXPERIMENTAL MODERATE DIFFUSE BRAIN INJURY IN RATS - COMPARISON BETWEEN DOSAGE, INJECTION TIME, AND TREATMENT METHODS, Yonsei medical journal, 39(5), 1998, pp. 395-403
Authors:
RHA SK
LEE WJ
LEE SY
HWANG YS
LEE YJ
KIM DI
KIM DW
CHUN SS
PARK CO
Citation: Sk. Rha et al., IMPROVED TIN FILM AS A DIFFUSION BARRIER BETWEEN COPPER AND SILICON, Thin solid films, 320(1), 1998, pp. 134-140
Authors:
LEE YJ
SUH BS
RHA SK
PARK CO
Citation: Yj. Lee et al., STRUCTURAL AND CHEMICAL-STABILITY OF TA-SI-N THIN-FILM BETWEEN SI ANDCU, Thin solid films, 320(1), 1998, pp. 141-146
Authors:
LEE SY
RHA SK
LEE WJ
KIM DW
HWANG JS
PARK CO
Citation: Sy. Lee et al., EFFECTS OF THE PARTIAL-PRESSURE OF COPPER(I) HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE ON THE CHEMICAL-VAPOR-DEPOSITION OF COPPER, JPN J A P 1, 36(8), 1997, pp. 5249-5252
Authors:
CHUNG SO
KIM JW
KIM GH
PARK CO
LEE WJ
Citation: So. Chung et al., FORMATION OF A LEAD-ZIRCONATE-TITANATE (PZT) PT INTERFACIAL LAYER ANDSTRUCTURAL-CHANGES IN THE PT/TI/SIO2/SI SUBSTRATE DURING THE DEPOSITION OF PZT THIN-FILM BY ELECTRON-CYCLOTRON-RESONANCE PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION/, JPN J A P 1, 36(7A), 1997, pp. 4386-4391
Authors:
RHA SK
LEE WJ
LEE SY
KIM DW
PARK CO
Citation: Sk. Rha et al., GRAIN-GROWTH OF COPPER-FILMS PREPARED BY CHEMICAL-VAPOR-DEPOSITION, Journal of materials science. Materials in electronics, 8(4), 1997, pp. 217-221
Authors:
KIM DW
KIM KJ
KIM DI
LEE WJ
LEE SY
LEE YJ
RHA SK
PARK CO
Citation: Dw. Kim et al., EFFECTS OF THE INTEGRITY OF SILICON THIN-FILMS ON THE ELECTRICAL CHARACTERISTICS OF THIN DIELECTRIC ONO FILM, Journal of materials science. Materials in electronics, 8(2), 1997, pp. 91-94
Authors:
RHA SK
LEE WJ
LEE SY
KIM DW
PARK CO
CHUN SS
Citation: Sk. Rha et al., INTERDIFFUSIONS AND REACTIONS IN CU TIN/TI/SI AND CU/TIN/TI/SIO2/SI MULTILAYER STRUCTURES/, Journal of materials research, 12(12), 1997, pp. 3367-3372
Authors:
LEE WJ
RHA SY
LEE SY
KIM DW
PARK CO
Citation: Wj. Lee et al., EFFECT OF THE PRESSURE ON THE CHEMICAL-VAPOR-DEPOSITION OF COPPER FROM COPPER HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE, Thin solid films, 305(1-2), 1997, pp. 254-258
Authors:
LEE WJ
RHA SK
LEE SY
PARK CO
Citation: Wj. Lee et al., FIELD-AIDED THERMAL CHEMICAL-VAPOR-DEPOSITION OF COPPER USING CU(I) ORGANOMETALLIC PRECURSOR, Journal of the Electrochemical Society, 144(2), 1997, pp. 683-686
Authors:
RHA SK
LEE WJ
LEE SY
KIM DW
PARK CO
CHUN SS
Citation: Sk. Rha et al., EFFECTS OF THE ANNEALING IN AR AND H-2 AR AMBIENTS ON THE MICROSTRUCTURE AND THE ELECTRICAL-RESISTIVITY OF THE COPPER FILM PREPARED BY CHEMICAL-VAPOR-DEPOSITION/, JPN J A P 1, 35(11), 1996, pp. 5781-5786
Authors:
LEE WJ
MIN JS
RHA SK
CHUN NS
PARK CO
KIM DW
Citation: Wj. Lee et al., COPPER CHEMICAL-VAPOR-DEPOSITION USING COPPER(I) HEXAFLUOROACETYLACETONATE TRIMETHYLVINYLSILANE, Journal of materials science. Materials in electronics, 7(2), 1996, pp. 111-117
Authors:
PARK CO
CHO KH
Citation: Co. Park et Kh. Cho, NONEXTRACTION TREATMENT OF A CLASS-II, DIVISION-1 MALOCCLUSION, American journal of orthodontics and dentofacial orthopedics, 109(3), 1996, pp. 227-233
Authors:
KIM DH
LEE YJ
PARK CO
PARK JW
KIM JJ
Citation: Dh. Kim et al., NUCLEATION REACTIONS AND FILM GROWTH OF COPPER ON TIN USING HEXAFLUOROACETYLACETONATE COPPER(I) TRIMETHYLVINYLSILANE, Chemical engineering communications, 153, 1996, pp. 307-317
Authors:
LEE CH
KIM YJ
SONG JW
PARK CO
Citation: Ch. Lee et al., INCORPORATION OF A NEW SPECTRAL HISTORY CORRECTION METHOD INTO LOCAL-POWER RECONSTRUCTION FOR NODAL METHODS, Nuclear science and engineering, 124(1), 1996, pp. 160-166
Authors:
LEE JY
PARK CO
BAEK HD
HWANG JS
Citation: Jy. Lee et al., MEDIUM-TEMPERATURE PERFORMANCE OF CERMET ELECTRODE CONTAINING AG AND 3BI(2)O(3)CENTER-DOT-WO3, Sensors and actuators. B, Chemical, 28(3), 1995, pp. 211-215
Authors:
KOH KK
KIM SH
LEE KH
KWON KS
KIM EJ
BAIK SH
CHO SK
KIM SS
PARK CO
CHUNG JK
LEE YH
Citation: Kk. Koh et al., DOES PREVALENCE OF MIGRAINE AND RAYNAUDS-PHENOMENON ALSO INCREASE IN KOREAN PATIENTS WITH PROVEN VARIANT ANGINA, International journal of cardiology, 51(1), 1995, pp. 37-46
Authors:
LEE YJ
PARK CO
BAEK HD
HWANG JS
Citation: Yj. Lee et al., GRAIN-BOUNDARY EFFECT IN (BI2O3)(0.75)(WO3)(0.25) AND (BI2O3)(0.7)(SRO)(0.3) SOLID ELECTROLYTES, Solid state ionics, 76(1-2), 1995, pp. 1-4
Authors:
MUN JK
PARK CO
YOON BI
KIM KS
JOO HJ
Citation: Jk. Mun et al., A STUDY OF THE EFFECTS OF VARIOUS INHIBITORS IN C C COMPOSITES/, Journal of Materials Science, 30(6), 1995, pp. 1529-1534
Authors:
PARK CO
POLONSKY L
SUCKEWER S
Citation: Co. Park et al., RECENT RESULTS ON DEVELOPMENT OF A TABLE-TOP SOFT-X-RAY LASER, Applied physics. B, Lasers and optics, 58(1), 1994, pp. 19-22
Authors:
LEE YJ
PARK CO
KIM DW
CHUN JS
Citation: Yj. Lee et al., THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER, Journal of electronic materials, 23(10), 1994, pp. 1075-1080
Authors:
CHANG KC
PARK CO
HONG SG
Citation: Kc. Chang et al., EFFECTS OF GS-386, A NOVEL DIHYDROISOQUINOLINE COMPOUND, ON RABBIT ATRIAL MYOCYTES AND RAT AORTA, Drug development research, 33(4), 1994, pp. 454-459