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Results:
1-20
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Results: 20
Authors:
ROSSNAGEL SM
Citation: Sm. Rossnagel, DIRECTIONAL AND IONIZED PHYSICAL VAPOR-DEPOSITION FOR MICROELECTRONICS APPLICATIONS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(5), 1998, pp. 2585-2608
Authors:
RADZIMSKI ZJ
POSADOWSKI WM
ROSSNAGEL SM
SHINGUBARA S
Citation: Zj. Radzimski et al., DIRECTIONAL COPPER DEPOSITION USING DC MAGNETRON SELF-SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(3), 1998, pp. 1102-1106
Authors:
HAMAGUCHI S
MAYO AA
ROSSNAGEL SM
KOTECKI DE
MILKOVE KR
WANG C
FARRELL CE
Citation: S. Hamaguchi et al., NUMERICAL-SIMULATION OF ETCHING AND DEPOSITION PROCESSES, JPN J A P 1, 36(7B), 1997, pp. 4762-4768
Authors:
MAYO AA
HAMAGUCHI S
JOO JH
ROSSNAGEL SM
Citation: Aa. Mayo et al., ACROSS-WAFER NONUNIFORMITY OF LONG THROW SPUTTER-DEPOSITION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(5), 1997, pp. 1788-1793
Authors:
NICHOLS CA
ROSSNAGEL SM
HAMAGUCHI S
Citation: Ca. Nichols et al., IONIZED PHYSICAL VAPOR-DEPOSITION OF CU FOR HIGH-ASPECT-RATIO DAMASCENE TRENCH FILL APPLICATIONS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(5), 1996, pp. 3270-3275
Authors:
HAMAGUCHI S
ROSSNAGEL SM
Citation: S. Hamaguchi et Sm. Rossnagel, LINER CONFORMALITY IN IONIZED MAGNETRON SPUTTER METAL-DEPOSITION PROCESSES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2603-2608
Authors:
ROSSNAGEL SM
NICHOLS C
HAMAGUCHI S
RUZIC D
TURKOT R
Citation: Sm. Rossnagel et al., THIN, HIGH ATOMIC-WEIGHT REFRACTORY FILM DEPOSITION FOR DIFFUSION BARRIER, ADHESION LAYER, AND SEED LAYER APPLICATIONS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(3), 1996, pp. 1819-1827
Authors:
GORBATKIN SM
POKER DB
RHOADES RL
DOUGHTY C
BERRY LA
ROSSNAGEL SM
Citation: Sm. Gorbatkin et al., CU METALLIZATION USING A PERMANENT-MAGNET ELECTRON-CYCLOTRON-RESONANCE MICROWAVE PLASMA SPUTTERING HYBRID SYSTEM/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(3), 1996, pp. 1853-1859
Authors:
KIM YW
PETROV I
GREENE JE
ROSSNAGEL SM
Citation: Yw. Kim et al., DEVELOPMENT OF 111 TEXTURE IN AL FILMS GROWN ON SIO2 SI(001) BY ULTRAHIGH-VACUUM PRIMARY-ION DEPOSITION/, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 14(2), 1996, pp. 346-351
Authors:
HAMAGUCHI S
ROSSNAGEL SM
Citation: S. Hamaguchi et Sm. Rossnagel, SIMULATIONS OF TRENCH-FILLING PROFILES UNDER IONIZED MAGNETRON SPUTTER METAL-DEPOSITION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(2), 1995, pp. 183-191
DIRECTIONAL DEPOSITION OF CU INTO SEMICONDUCTOR TRENCH STRUCTURES USING IONIZED MAGNETRON SPUTTERING
Authors:
CHENG PF
ROSSNAGEL SM
RUZIC DN
Citation: Pf. Cheng et al., DIRECTIONAL DEPOSITION OF CU INTO SEMICONDUCTOR TRENCH STRUCTURES USING IONIZED MAGNETRON SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(2), 1995, pp. 203-208
Authors:
NAEEM MD
ROSSNAGEL SM
RAJAN K
Citation: Md. Naeem et al., GRAIN-GROWTH IN COPPER-FILMS EXPOSED TO MAGNETICALLY ENHANCED PLASMAS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(2), 1995, pp. 209-213
Authors:
ROSSNAGEL SM
Citation: Sm. Rossnagel, FILLING DUAL DAMASCENE INTERCONNECT STRUCTURES WITH ALCU AND CU USINGIONIZED MAGNETRON DEPOSITION, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(1), 1995, pp. 125-129
Authors:
ROSSNAGEL SM
SWARD R
Citation: Sm. Rossnagel et R. Sward, COLLIMATED MAGNETRON SPUTTER-DEPOSITION WITH GRAZING ANGLE ION-BOMBARDMENT, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(1), 1995, pp. 156-158
Authors:
ROSSNAGEL SM
Citation: Sm. Rossnagel, DIRECTIONAL AND PREFERENTIAL SPUTTERING-BASED PHYSICAL VAPOR-DEPOSITION, Thin solid films, 263(1), 1995, pp. 1-12
Authors:
ROSSNAGEL SM
HOPWOOD J
Citation: Sm. Rossnagel et J. Hopwood, METAL-ION DEPOSITION FROM IONIZED MAGNETRON SPUTTERING DISCHARGE, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(1), 1994, pp. 449-453
Authors:
KIM YW
MOSER J
PETROV I
GREENE JE
ROSSNAGEL SM
Citation: Yw. Kim et al., DIRECTED SPUTTER-DEPOSITION OF ALCU - FILM MICROSTRUCTURE AND MICROCHEMISTRY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 12(6), 1994, pp. 3169-3175
Authors:
TURNER GM
ROSSNAGEL SM
CUOMO JJ
Citation: Gm. Turner et al., MEASURED RADIAL AND ANGULAR-DISTRIBUTIONS OF SPUTTERED ATOMS IN A PLANAR MAGNETRON DISCHARGE, Journal of applied physics, 75(7), 1994, pp. 3611-3618
Authors:
TURNER GM
ROSSNAGEL SM
CUOMO JJ
Citation: Gm. Turner et al., DIRECTIONALITY OF SPUTTERED CU ATOMS IN A HOLLOW-CATHODE ENHANCED PLANAR MAGNETRON, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 11(5), 1993, pp. 2796-2801
Authors:
ROSSNAGEL SM
HOPWOOD J
Citation: Sm. Rossnagel et J. Hopwood, MAGNETRON SPUTTER-DEPOSITION WITH HIGH-LEVELS OF METAL IONIZATION, Applied physics letters, 63(24), 1993, pp. 3285-3287
Risultati:
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