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Results:
1-18
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Results: 18
Authors:
Poppe, A
Farkas, G
Rencz, M
Benedek, Z
Pohl, L
Szekely, V
Torki, K
Mir, S
Courtois, B
Citation: A. Poppe et al., Design issues of a multi-functional intelligent thermal test die, P IEEE SEM, 2001, pp. 50-57
Authors:
Rencz, M
Szekely, V
Citation: M. Rencz et V. Szekely, A generic method for thermal multiport model generation of IC packages, P IEEE SEM, 2001, pp. 145-152
Authors:
Szekely, V
Rencz, M
Poppe, A
Courtois, B
Citation: V. Szekely et al., THERMODEL: A tool for thermal model generation, and application for MEMS, ANALOG IN C, 29(1-2), 2001, pp. 49-59
Authors:
Szekely, V
Rencz, M
Citation: V. Szekely et M. Rencz, THERMINIC 2000, MICROELEC J, 32(10-11), 2001, pp. 795-796
Authors:
Szekely, V
Rencz, M
Citation: V. Szekely et M. Rencz, Thermal dynamics and the time constant domain, IEEE T COMP, 23(3), 2000, pp. 587-594
Authors:
Rencz, M
Szekely, V
Torok, S
Torki, K
Courtois, B
Citation: M. Rencz et al., I-DDQ testing of submicron CMOS-by cooling ?, J ELEC TEST, 16(5), 2000, pp. 453-461
Authors:
Szekely, V
Poppe, A
Rencz, M
Rosental, M
Teszeri, T
Citation: V. Szekely et al., THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards, MICROEL REL, 40(3), 2000, pp. 517-524
Authors:
Rencz, M
Szekely, V
Citation: M. Rencz et V. Szekely, Papers presented at the 1999 Workshop on the Thermal Investigations of ICsand Microstructures (THERMINIC), MICROELEC J, 31(9-10), 2000, pp. 725-726
Authors:
Szekely, V
Ress, S
Poppe, A
Torok, S
Magyari, D
Benedek, Z
Torki, K
Courtois, B
Rencz, M
Citation: V. Szekely et al., New approaches in the transient thermal measurements, MICROELEC J, 31(9-10), 2000, pp. 727-733
Authors:
Szekely, V
Nagy, A
Torok, S
Hajas, G
Rencz, M
Citation: V. Szekely et al., Realization of an electronically controlled thermal resistance, MICROELEC J, 31(9-10), 2000, pp. 811-814
Authors:
Szekely, V
Rencz, M
Poppe, A
Courtois, B
Citation: V. Szekely et al., New hardware tools for the thermal transient testing of packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 46-52
Authors:
Szekely, V
Rencz, M
Pahi, A
Courtois, B
Citation: V. Szekely et al., Thermal monitoring and testing of electronic systems, IEEE T COMP, 22(2), 1999, pp. 231-237
Authors:
Szekely, V
Rencz, M
Citation: V. Szekely et M. Rencz, Image processing procedures for the thermal measurements, IEEE T COMP, 22(2), 1999, pp. 259-265
Authors:
Szekely, V
Pahi, A
Poppe, A
Rencz, M
Citation: V. Szekely et al., Electro-thermal simulation with the SISSI package, ANALOG IN C, 21(1), 1999, pp. 21-31
Authors:
Szekely, V
Rencz, M
Courtois, B
Citation: V. Szekely et al., A step forward in the transient thermal characterization of chips and packages, MICROEL REL, 39(1), 1999, pp. 89-96
Authors:
Rencz, M
Szekely, V
Courtois, B
Citation: M. Rencz et al., Papers presented at the 1998 Workshop on Thermal Investigations of ICs andMicrostructures (THERMINIC), MICROELEC J, 30(11), 1999, pp. 1083-1084
Authors:
Morrissey, A
Alderman, J
Kelly, G
Kohari, Z
Pahi, A
Rencz, M
Citation: A. Morrissey et al., Packaging and thermal evaluation of thermally operated intelligent micropump unit, MICROELEC J, 30(11), 1999, pp. 1109-1114
Authors:
Kohari, Z
Szekely, V
Rencz, M
Pahl, A
Dudek, V
Hofflinger, B
Citation: Z. Kohari et al., Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED), MICROEL REL, 38(12), 1998, pp. 1881-1891
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