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Results: 1-25/26
Authors:
SMY T
TAN L
CHAN K
TAIT RN
BROUGHTON JN
DEW SK
BRETT MJ
Citation: T. Smy et al., A SIMULATION STUDY OF LONG THROW SPUTTERING FOR DIFFUSION BARRIER DEPOSITION INTO HIGH ASPECT VIAS AND CONTACTS, I.E.E.E. transactions on electron devices, 45(7), 1998, pp. 1414-1425
Authors:
FRIEDRICH LJ
GARDNER DS
DEW SK
BRETT MJ
SMY T
Citation: Lj. Friedrich et al., STUDY OF THE COPPER REFLOW PROCESS USING THE GROFILMS SIMULATOR, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(5), 1997, pp. 1780-1787
Authors:
SMY T
TAN L
WINTERTON SS
DEW SK
BRETT MJ
Citation: T. Smy et al., SIMULATION OF SPUTTER-DEPOSITION AT HIGH-PRESSURES, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(6), 1997, pp. 2847-2853
SIMULATION OF ELECTROLESS DEPOSITION OF CU THIN-FILMS FOR VERY LARGE-SCALE INTEGRATION METALLIZATION
Authors:
SMY T
TAN L
DEW SK
BRETT MJ
SHACHAMDIAMAND Y
DESILVA M
Citation: T. Smy et al., SIMULATION OF ELECTROLESS DEPOSITION OF CU THIN-FILMS FOR VERY LARGE-SCALE INTEGRATION METALLIZATION, Journal of the Electrochemical Society, 144(6), 1997, pp. 2115-2122
Authors:
SHEERGAR MK
SMY T
DEW SK
BRETT MJ
Citation: Mk. Sheergar et al., SIMULATION OF 3-DIMENSIONAL REFRACTORY-METAL STEP COVERAGE OVER CONTACT CUTS AND VIAS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2595-2602
Authors:
TAIT RN
DEW SK
TSAI W
HODUL D
SMY T
BRETT MJ
Citation: Rn. Tait et al., SIMULATION OF UNIFORMITY AND LIFETIME EFFECTS IN COLLIMATED SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(2), 1996, pp. 679-686
Authors:
SMY T
DEW SK
BRETT MJ
Citation: T. Smy et al., SIMULATION OF MICROSTRUCTURE AND SURFACE PROFILES OF THIN-FILMS FOR VLSI METALLIZATION, MRS bulletin, 20(11), 1995, pp. 65-69
Authors:
ROBBIE K
FRIEDRICH LJ
DEW SK
SMY T
BRETT MJ
Citation: K. Robbie et al., FABRICATION OF THIN-FILMS WITH HIGHLY POROUS MICROSTRUCTURES, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(3), 1995, pp. 1032-1035
Authors:
TAIT RN
SMY T
DEW SK
BRETT MJ
Citation: Rn. Tait et al., NODULAR DEFECT GROWTH AND STRUCTURE IN VAPOR-DEPOSITED FILMS, Journal of electronic materials, 24(8), 1995, pp. 935-940
Authors:
FRIEDRICH LJ
DEW SK
BRETT M
SMY T
Citation: Lj. Friedrich et al., THIN-FILM MICROSTRUCTURE MODELING THROUGH LINE-SEGMENT SIMULATION, Thin solid films, 266(1), 1995, pp. 83-88
Authors:
SORLIE C
BRETT MJ
DEW SK
SMY T
Citation: C. Sorlie et al., ADVANCED PROCESS SIMULATION OF METAL-FILM DEPOSITION, Solid state technology, 38(6), 1995, pp. 101
Authors:
GUI X
FRIEDRICH LJ
DEW SK
BRETT MJ
SMY T
Citation: X. Gui et al., GRAIN-BOUNDARY DIFFUSION MODELING AND EFFICIENCY EVALUATION OF THIN-FILM DIFFUSION-BARRIERS CONSIDERING MICROSTRUCTURE EFFECTS, Journal of applied physics, 78(7), 1995, pp. 4438-4443
Authors:
WINTERTON SS
SMY T
DEW SK
BRETT MJ
Citation: Ss. Winterton et al., SIMULATION OF THE EFFECT OF BULK VACANCY DIFFUSION ON THE SHAPE OF SPUTTERED FILMS DEPOSITED ONTO TRENCHES AND VIAS, Journal of applied physics, 78(6), 1995, pp. 3572-3579
Authors:
SMY T
SALAHUDDIN M
DEW SK
BRETT MJ
Citation: T. Smy et al., EXPLANATION OF SPURIOUS FEATURES IN TUNGSTEN DEPOSITION USING AN ATOMIC MOMENTUM MODEL, Journal of applied physics, 78(6), 1995, pp. 4157-4163
Authors:
SMY T
DEW SK
BRETT MJ
Citation: T. Smy et al., SIMULATION AND EXPERIMENTAL-ANALYSIS OF REFRACTORY-METAL AND ALUMINUMDEPOSITION OVER HIGH-ASPECT-RATIO VLSI TOPOGRAPHY, Canadian metallurgical quarterly, 34(3), 1995, pp. 195-202
Authors:
TSAI W
HODUL D
SHENG T
DEW S
ROBBIE K
BRETT MJ
SMY T
Citation: W. Tsai et al., VARIATION OF COMPOSITION OF SPUTTERED TIN FILMS AS A FUNCTION OF TARGET NITRIDATION, THERMAL ANNEAL, AND SUBSTRATE TOPOGRAPHY, Applied physics letters, 67(2), 1995, pp. 220-222
Authors:
DEW S
SMY T
BRETT M
Citation: S. Dew et al., STEP COVERAGE, UNIFORMITY AND COMPOSITION STUDIES USING INTEGRATED VAPOR TRANSPORT AND FILM-DEPOSITION MODELS, JPN J A P 1, 33(2), 1994, pp. 1140-1145
Authors:
TAIT RN
DEW SK
SMY T
BRETT MJ
Citation: Rn. Tait et al., MONTE-CARLO SIMULATION AND MEASUREMENT OF SILICON REACTIVE ION ETCHING PROFILES, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 12(4), 1994, pp. 1085-1089
Authors:
LI P
SMY T
DEW SK
BRETT MJ
Citation: P. Li et al., SIMULATION AND EXPERIMENTAL-ANALYSIS OF PLANARIZATION OF REFRACTORY-METALS USING A MULTISTEP SPUTTER SPUTTER ETCH PROCESS/, Journal of electronic materials, 23(11), 1994, pp. 1215-1220
Authors:
TSAI W
BRETT MJ
DEW SK
LIU D
SMY T
TAIT RN
Citation: W. Tsai et al., BOMBARDMENT AND GAS RAREFACTION EFFECTS ON THE PROPERTIES OF SPUTTERED TI THIN-FILMS, Thin solid films, 253(1-2), 1994, pp. 386-390
Authors:
SMY T
WINTERTON SS
DEW SK
BRETT MJ
Citation: T. Smy et al., SIMULATION AND ANALYSIS OF ELECTROMIGRATION FAILURE DISTRIBUTIONS, Microelectronics and reliability, 34(6), 1994, pp. 1047-1056
Authors:
LIU D
DEW SK
BRETT MJ
SMY T
TSAI W
Citation: D. Liu et al., COMPOSITIONAL VARIATIONS IN TI-W FILMS SPUTTERED OVER TOPOGRAPHICAL FEATURES, Journal of applied physics, 75(12), 1994, pp. 8114-8120
Authors:
DEW SK
LIU D
BRETT MJ
SMY T
Citation: Sk. Dew et al., SPATIAL AND ANGULAR NONUNIFORMITIES FROM COLLIMATED SPUTTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 11(4), 1993, pp. 1281-1286
Authors:
LIU D
DEW SK
BRETT MJ
JANACEK T
SMY T
TSAI W
Citation: D. Liu et al., PROPERTIES OF TITANIUM AND ALUMINUM THIN-FILMS DEPOSITED BY COLLIMATED SPUTTERING, Thin solid films, 236(1-2), 1993, pp. 267-273
Authors:
TAIT RN
SMY T
BRETT MJ
Citation: Rn. Tait et al., MODELING AND CHARACTERIZATION OF COLUMNAR GROWTH IN EVAPORATED-FILMS, Thin solid films, 226(2), 1993, pp. 196-201