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Results:
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Results: 18
Authors:
Uschitsky, M
Suhir, E
Kammlott, GW
Citation: M. Uschitsky et al., Thermoelastic behavior of filled molding compounds Composite mechanics approach, J ELEC PACK, 123(3), 2001, pp. 260-267
Authors:
Uschitsky, M
Suhir, E
Citation: M. Uschitsky et E. Suhir, Moisture diffusion in epoxy molding compounds filled with particles, J ELEC PACK, 123(1), 2001, pp. 47-51
Authors:
Suhir, E
Citation: E. Suhir, Thermal stress in a polymer-coated optical glass fiber with a low-modulus coating at the ends, J MATER RES, 16(10), 2001, pp. 2996-3004
Authors:
Suhir, E
Citation: E. Suhir, Analysis of interfacial thermal stresses in a trimaterial assembly, J APPL PHYS, 89(7), 2001, pp. 3685-3694
Authors:
Suhir, E
Citation: E. Suhir, Predicted thermal stresses in a bimaterial assembly adhesively bonded at the ends, J APPL PHYS, 89(1), 2001, pp. 120-129
Authors:
Suhir, E
Citation: E. Suhir, Jane Fonda, AM HERITAGE, 52(7), 2001, pp. 14-14
Authors:
Bergles, AE
Suhir, E
Citation: Ae. Bergles et E. Suhir, Dr. Allan D. Kraus on his 75th birthday, J ELEC PACK, 122(4), 2000, pp. 289-290
Authors:
Suhir, E
Chang, CS
Citation: E. Suhir et Cs. Chang, Untitled, J ELEC PACK, 122(1), 2000, pp. 1-2
Authors:
Suhir, E
Citation: E. Suhir, Predicted fundamental vibration frequency of a heavy electronic component mounted on a printed circuit board, J ELEC PACK, 122(1), 2000, pp. 3-5
Authors:
Suhir, E
Vuillemin, J
Citation: E. Suhir et J. Vuillemin, Effects of the CTE and Young's modulus lateral gradients on the bowing of an optical fiber: analytical and finite element modeling, OPT ENG, 39(12), 2000, pp. 3317-3321
Authors:
Suhir, E
Citation: E. Suhir, Microelectronics and photonics - the future, MICROELEC J, 31(11-12), 2000, pp. 839-851
Authors:
Suhir, E
Citation: E. Suhir, Optical fiber interconnect with the ends offset and axial loading: What could be done to reduce the tensile stress in the fiber?, J APPL PHYS, 88(7), 2000, pp. 3865-3871
Authors:
Suhir, E
Citation: E. Suhir, Predicted thermally induced stresses in, and the bow of, a circular substrate/thin-film structure, J APPL PHYS, 88(5), 2000, pp. 2363-2370
Authors:
Suhir, E
Citation: E. Suhir, Adhesively bonded assemblies with identical nondeformable adherends and 'piecewise continuous' adhesive layer: predicted thermal stresses in the adhesive, INT J SOL S, 37(16), 2000, pp. 2229-2252
Authors:
Suhir, E
Citation: E. Suhir, Modeling of the mechanical behavior of materials in "high-tech" systems: Attributes and review, J ELEC PACK, 121(4), 1999, pp. 213-221
Authors:
Suhir, E
Citation: E. Suhir, Adhesively bonded assemblies with identical nondeformable adherends: modeling of the induced thermal stresses in the adhesive layer, COMPOS INTE, 6(2), 1999, pp. 135-154
Authors:
Suhir, E
Citation: E. Suhir, Adhesively bonded assemblies with identical nondeformable adherends and nonhomogeneous adhesive layer: Predicted thermal stresses in the adhesive, J REINF PL, 17(18), 1998, pp. 1588-1606
Authors:
Suhir, E
Weld, JD
Citation: E. Suhir et Jd. Weld, Application of a 'surrogate' layer for lower bending stress in a vulnerable material of a tri-material body, MICROEL REL, 38(12), 1998, pp. 1949-1954
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