AAAAAA
Results:
1-17
|
Results: 17
Authors:
Liu, PL
Shang, JK
Citation: Pl. Liu et Jk. Shang, Interfacial segregation of bismuth in copper/tin-bismuth solder interconnect, SCR MATER, 44(7), 2001, pp. 1019-1023
Authors:
Shang, JK
Tan, X
Citation: Jk. Shang et X. Tan, Indentation-induced domain switching in Pb(Mg1/3Nb2/3)O-3-PbTiO3 crystal, ACT MATER, 49(15), 2001, pp. 2993-2999
Authors:
Tan, XL
Xu, ZK
Shang, JK
Citation: Xl. Tan et al., In situ transmission electron microscopy observations of electric-field-induced domain switching and microcracking in ferroelectric ceramics, MAT SCI E A, 314(1-2), 2001, pp. 157-161
Authors:
Wang, Z
McMahon, C
Shang, JK
Peralta, PD
Citation: Z. Wang et al., Cyclic deformation and fatigue of solids: An International Symposium in Honour of Professor Campbell Laird - Preface, MAT SCI E A, 314(1-2), 2001, pp. IX-X
Authors:
Shang, JK
Tan, XL
Citation: Jk. Shang et Xl. Tan, A maximum strain criterion for electric-field-induced fatigue crack propagation in ferroelectric ceramics, MAT SCI E A, 301(2), 2001, pp. 131-139
Authors:
Liu, PL
Shang, JK
Citation: Pl. Liu et Jk. Shang, Interfacial embrittlement by bismuth segregation in copper/tin-bismuth Pb-free solder interconnect, J MATER RES, 16(6), 2001, pp. 1651-1659
Authors:
Du, TB
Liu, M
Seghi, S
Hsia, KJ
Economy, J
Shang, JK
Citation: Tb. Du et al., Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds, J MATER RES, 16(10), 2001, pp. 2885-2892
Authors:
Shang, JK
Huang, RF
Wilcox, DL
Citation: Jk. Shang et al., A microindentation technique for determining strength of solder interface with silver metallization on co-fired multilayer ceramic substrate, J ELEC MAT, 30(3), 2001, pp. 260-265
Authors:
Tan, XL
Shang, JK
Citation: Xl. Tan et Jk. Shang, Crack deflection in relaxor ferroelectric PLZT under inclined cyclic electric field, SCR MATER, 43(10), 2000, pp. 925-928
Authors:
Liu, PL
Xu, ZK
Shang, JK
Citation: Pl. Liu et al., Thermal stability of electroless-nickel/solder interface: Part A. Interfacial chemistry and microstructure, MET MAT T A, 31(11), 2000, pp. 2857-2866
Authors:
Liu, PL
Shang, JK
Citation: Pl. Liu et Jk. Shang, Thermal stability of electroless-nickel/solder interface: Part B. Interfacial fatigue resistance, MET MAT T A, 31(11), 2000, pp. 2867-2875
Authors:
Liu, PL
Shang, JK
Popoola, OO
Citation: Pl. Liu et al., Fatigue behavior of a thermally sprayed low carbon steel coating, MAT SCI E A, 277(1-2), 2000, pp. 176-182
Authors:
Liu, PL
Shang, JK
Citation: Pl. Liu et Jk. Shang, A comparative fatigue study of solder/electroless-nickel and solder/copperinterfaces, J MATER RES, 15(11), 2000, pp. 2347-2355
Authors:
Liu, PL
Shang, JK
Citation: Pl. Liu et Jk. Shang, Influence of microstructure on fatigue crack growth behavior of Sn-Ag solder interfaces, J ELEC MAT, 29(5), 2000, pp. 622-627
Authors:
Tan, X
Xu, Z
Shang, JK
Han, P
Citation: X. Tan et al., Direct observations of electric field-induced domain boundary cracking in < 001 > oriented piezoelectric Pb(Mg1/3Nb2/3)O-3-PbTiO3 single crystal, APPL PHYS L, 77(10), 2000, pp. 1529-1531
Authors:
Xu, Z
Tan, X
Han, P
Shang, JK
Citation: Z. Xu et al., In situ transmission electron microscopy study of electric-field-induced microcracking in single crystal Pb(Mg1/3Nb2/3)O-3-PbTiO3, APPL PHYS L, 76(25), 2000, pp. 3732-3734
Authors:
Deppisch, C
Liu, G
Hall, A
Xu, Y
Zangvil, A
Shang, JK
Economy, J
Citation: C. Deppisch et al., The crystallization and growth of AlB2 single crystal flakes in aluminum, J MATER RES, 13(12), 1998, pp. 3485-3498
Risultati:
1-17
|