Results: 1-14 |
Results: 14
0.15 MU-M CMOS DEVICES WITH REDUCED JUNCTION CAPACITANCE
Authors: TANABE A TAKEUCHI K YAMAMOTO T MATSUKI T KUNIO T FUKUMA M NAKAJIMA K AIZAKI N MIYAMOTO H IKAWA E
Citation: A. Tanabe et al., 0.15 MU-M CMOS DEVICES WITH REDUCED JUNCTION CAPACITANCE, IEICE transactions on electronics, E78C(3), 1995, pp. 267-273
A 3-PHASE SINE-WAVE INVERTER SYSTEM USING MULTIPLE PHASE-SHIFTED SINGLE-PHASE RESONANT INVERTERS
Authors: OGUCHI K IKAWA E TSUKIORI Y
Citation: K. Oguchi et al., A 3-PHASE SINE-WAVE INVERTER SYSTEM USING MULTIPLE PHASE-SHIFTED SINGLE-PHASE RESONANT INVERTERS, IEEE transactions on industry applications, 29(6), 1993, pp. 1076-1083
A CAPACITOR OVER BIT-LINE (COB) STACKED CAPACITOR CELL USING LOCAL INTERCONNECT LAYER FOR 64 MBDRAMS
Authors: KASAI N SAKAO M ISHIJIMA T IKAWA E WATANABE H TAKESHIMA T TANABE N TERADA K KIKKAWA T
Citation: N. Kasai et al., A CAPACITOR OVER BIT-LINE (COB) STACKED CAPACITOR CELL USING LOCAL INTERCONNECT LAYER FOR 64 MBDRAMS, IEICE transactions on electronics, E76C(4), 1993, pp. 548-555
ANALYSIS OF FLUOROCARBON FILM DEPOSITED BY HIGHLY SELECTIVE OXIDE ETCHING
Authors: AKIMOTO T FURUOYA S HARASIMA K IKAWA E
Citation: T. Akimoto et al., ANALYSIS OF FLUOROCARBON FILM DEPOSITED BY HIGHLY SELECTIVE OXIDE ETCHING, JPN J A P 1, 33(4B), 1994, pp. 2151-2156
CASCADED HIGH-T-C BULK SUPERCONDUCTOR LENSES (SUPERTRONS) FOR INTENSEELECTRON-BEAMS
Authors: OHSHIMA A MATSUZAWA H MIZUTANI Y SHOJI K IKAWA E CHINO Y SUGANOMATA S
Citation: A. Ohshima et al., CASCADED HIGH-T-C BULK SUPERCONDUCTOR LENSES (SUPERTRONS) FOR INTENSEELECTRON-BEAMS, JPN J A P 1, 34(7A), 1995, pp. 3511-3517
DIRECT ANALYSIS OF CONTAMINATION IN SUBMICRON CONTACT HOLES BY THERMAL-DESORPTION SPECTROSCOPY
Authors: AOKI H TERAOKA Y IKAWA E KIKKAWA T NISHIYAMA I
Citation: H. Aoki et al., DIRECT ANALYSIS OF CONTAMINATION IN SUBMICRON CONTACT HOLES BY THERMAL-DESORPTION SPECTROSCOPY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(1), 1995, pp. 42-46
GATE ELECTRODE ETCHING USING A TRANSFORMER COUPLED PLASMA
Authors: YOSHIDA K MIYAMOTO H IKAWA E MURAO Y
Citation: K. Yoshida et al., GATE ELECTRODE ETCHING USING A TRANSFORMER COUPLED PLASMA, JPN J A P 1, 34(4B), 1995, pp. 2089-2094
MODEL FOR AL ETCH-RATE ENHANCEMENT AT LOW-TEMPERATURES
Authors: UCHIDA T AOKI H HANE M HASEGAWA S IKAWA E
Citation: T. Uchida et al., MODEL FOR AL ETCH-RATE ENHANCEMENT AT LOW-TEMPERATURES, JPN J A P 1, 32(12B), 1993, pp. 6095-6101
MULTILAYER RESIST DRY-ETCHING TECHNOLOGY FOR DEEP-SUBMICRON LITHOGRAPHY
Authors: TOKASHIKI K SATO K AOTO N IKAWA E
Citation: K. Tokashiki et al., MULTILAYER RESIST DRY-ETCHING TECHNOLOGY FOR DEEP-SUBMICRON LITHOGRAPHY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 11(6), 1993, pp. 2284-2287
OBSERVATION OF SIDEWALL CONTAMINATION IN SUBMICRON CONTACT HOLES BY THERMAL-DESORPTION SPECTROSCOPY
Authors: TERAOKA Y AOKI H IKAWA E KIKKAWA T NISHIYAMA I
Citation: Y. Teraoka et al., OBSERVATION OF SIDEWALL CONTAMINATION IN SUBMICRON CONTACT HOLES BY THERMAL-DESORPTION SPECTROSCOPY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(6), 1995, pp. 2197-2200
OXIDE ETCHING USING SURFACE-WAVE COUPLED PLASMA
Authors: AKIMOTO T IKAWA E SANGO T KOMACHI K KATAYAMA K EBATA T
Citation: T. Akimoto et al., OXIDE ETCHING USING SURFACE-WAVE COUPLED PLASMA, JPN J A P 1, 33(12B), 1994, pp. 7037-7041
REACTIVE ION ETCHING LAG ON HIGH-RATE OXIDE ETCHING USING HIGH-DENSITY PLASMA
Authors: AKIMOTO T NANBU H IKAWA E
Citation: T. Akimoto et al., REACTIVE ION ETCHING LAG ON HIGH-RATE OXIDE ETCHING USING HIGH-DENSITY PLASMA, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(6), 1995, pp. 2390-2393
THERMAL-DESORPTION SPECTROSCOPIC ANALYSIS FOR RESIDUAL CHLORINE ON AL-SI-CU AFTER CL-2 ELECTRON-CYCLOTRON-RESONANCE PLASMA-ETCHING
Authors: TERAOKA Y AOKI H NISHIYAMA I IKAWA E KIKKAWA T
Citation: Y. Teraoka et al., THERMAL-DESORPTION SPECTROSCOPIC ANALYSIS FOR RESIDUAL CHLORINE ON AL-SI-CU AFTER CL-2 ELECTRON-CYCLOTRON-RESONANCE PLASMA-ETCHING, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(6), 1995, pp. 2935-2938
WAFER TREATMENT USING ELECTROLYSIS-IONIZED WATER
Authors: AOKI H NAKAMORI M AOTO N IKAWA E
Citation: H. Aoki et al., WAFER TREATMENT USING ELECTROLYSIS-IONIZED WATER, JPN J A P 1, 33(10), 1994, pp. 5686-5689
Risultati: 1-14 |