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Results: 1-22 |
Results: 22
A THERMAL BENCHMARK CHIP - DESIGN AND APPLICATIONS
Authors: SZEKELY V MARTA C RENCZ M VEGH G BENEDEK Z TOROK S
Citation: V. Szekely et al., A THERMAL BENCHMARK CHIP - DESIGN AND APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 399-405
IDENTIFICATION OF RC-NETWORKS BY DECONVOLUTION - CHANCES AND LIMITS
Authors: SZEKELY V
Citation: V. Szekely, IDENTIFICATION OF RC-NETWORKS BY DECONVOLUTION - CHANCES AND LIMITS, IEEE transactions on circuits and systems. 1, Fundamental theory andapplications, 45(3), 1998, pp. 244-258
THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES
Authors: COURTOIS B SZEKELY V RENCZ M
Citation: B. Courtois et al., THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES, Sensors and actuators. A, Physical, 71(1-2), 1998, pp. 1-2
CMOS TEMPERATURE SENSORS AND BUILT-IN-TEST CIRCUITRY FOR THERMAL TESTING OF ICS
Authors: SZEKELY V RENCZ M TOROK S MARTA C LIPTAKFEGO L
Citation: V. Szekely et al., CMOS TEMPERATURE SENSORS AND BUILT-IN-TEST CIRCUITRY FOR THERMAL TESTING OF ICS, Sensors and actuators. A, Physical, 71(1-2), 1998, pp. 10-18
THERMAL MONITORING OF SELF-CHECKING SYSTEMS
Authors: SZEKELY V RENCZ M KARAM JM LUBASZEWSKI M COURTOIS B
Citation: V. Szekely et al., THERMAL MONITORING OF SELF-CHECKING SYSTEMS, JOURNAL OF ELECTRONIC TESTING-THEORY AND APPLICATIONS, 12(1-2), 1998, pp. 81-92
CAD TOOLS AND FOUNDRIES TO BOOST MICROSYSTEMS DEVELOPMENT
Authors: COURTOIS B KARAM JM LUBASZEWSKI M SZEKELY V RENCZ M HOFMANN K GLESNER M
Citation: B. Courtois et al., CAD TOOLS AND FOUNDRIES TO BOOST MICROSYSTEMS DEVELOPMENT, Materials science & engineering. B, Solid-state materials for advanced technology, 51(1-3), 1998, pp. 242-253
TRACING THE THERMAL-BEHAVIOR OF ICS
Authors: SZEKELY V RENCZ M COURTOIS B
Citation: V. Szekely et al., TRACING THE THERMAL-BEHAVIOR OF ICS, IEEE design & test of computers, 15(2), 1998, pp. 14-21
THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES II
Authors: SZEKELY V RENCZ M COURTOIS B
Citation: V. Szekely et al., THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES II, Microelectronics, 29(4-5), 1998, pp. 159-162
AN EFFICIENT THERMAL SIMULATION TOOL FOR ICS, MICROSYSTEM ELEMENTS AND MCMS - THE MU-S-THERMANAL
Authors: CSENDES A SZEKELY V RENCZ M
Citation: A. Csendes et al., AN EFFICIENT THERMAL SIMULATION TOOL FOR ICS, MICROSYSTEM ELEMENTS AND MCMS - THE MU-S-THERMANAL, Microelectronics, 29(4-5), 1998, pp. 241-255
THERMODEL - A TOOL FOR COMPACT DYNAMIC THERMAL-MODEL GENERATION
Authors: SZEKELY V
Citation: V. Szekely, THERMODEL - A TOOL FOR COMPACT DYNAMIC THERMAL-MODEL GENERATION, Microelectronics, 29(4-5), 1998, pp. 257-267
ELECTROTHERMAL AND LOGI-THERMAL SIMULATION OF VLSI DESIGNS
Authors: SZEKELY V POPPE A PAHI A CSENDES A HAJAS G RENCZ M
Citation: V. Szekely et al., ELECTROTHERMAL AND LOGI-THERMAL SIMULATION OF VLSI DESIGNS, IEEE transactions on very large scale integration (VLSI) systems, 5(3), 1997, pp. 258-269
CMOS SENSORS FOR ONLINE THERMAL MONITORING OF VLSI CIRCUITS
Authors: SZEKELY V MARTA C KOHARI Z RENCZ M
Citation: V. Szekely et al., CMOS SENSORS FOR ONLINE THERMAL MONITORING OF VLSI CIRCUITS, IEEE transactions on very large scale integration (VLSI) systems, 5(3), 1997, pp. 270-276
THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES
Authors: SZEKELY V RENCZ M COURTOIS B
Citation: V. Szekely et al., THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES, Microelectronics, 28(3), 1997, pp. 205-207
ELECTROTHERMAL SIMULATION - A REALIZATION BY SIMULTANEOUS-ITERATION
Authors: SZEKELY V POPPE A RENCZ M CSENDES A PAHI A
Citation: V. Szekely et al., ELECTROTHERMAL SIMULATION - A REALIZATION BY SIMULTANEOUS-ITERATION, Microelectronics, 28(3), 1997, pp. 247-262
A NEW EVALUATION METHOD OF THERMAL TRANSIENT MEASUREMENT RESULTS
Authors: SZEKELY V
Citation: V. Szekely, A NEW EVALUATION METHOD OF THERMAL TRANSIENT MEASUREMENT RESULTS, Microelectronics, 28(3), 1997, pp. 277-292
THERMAL INVESTIGATION OF MONOLITHIC STRUCTURES
Authors: KOHARI Z CSENDES A SZEKELY V RENCZ M
Citation: Z. Kohari et al., THERMAL INVESTIGATION OF MONOLITHIC STRUCTURES, Microelectronics, 28(3), 1997, pp. 317-325
COOLING AS A POSSIBLE WAY TO EXTEND THE USABILITY OF I-DDQ TESTING
Authors: SZEKELY V RENCZ M TOROK S COURTOIS B
Citation: V. Szekely et al., COOLING AS A POSSIBLE WAY TO EXTEND THE USABILITY OF I-DDQ TESTING, Electronics Letters, 33(25), 1997, pp. 2117-2118
SPECIAL ISSUE CONTAINING SELECTED PAPERS FROM THE INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES (THERMINIC WORKSHOP) HELD IN GRENOBLE, FRANCE, 25-26 SEPTEMBER 1995 - EDITORIAL
Authors: SZEKELY V RENCZ M COURTOIS B
Citation: V. Szekely et al., SPECIAL ISSUE CONTAINING SELECTED PAPERS FROM THE INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES (THERMINIC WORKSHOP) HELD IN GRENOBLE, FRANCE, 25-26 SEPTEMBER 1995 - EDITORIAL, Sensors and actuators. A, Physical, 55(1), 1996, pp. 1-2
DESIGN FOR THERMAL TESTABILITY (DFTT) AND A CMOS REALIZATION
Authors: SZEKELY V MARTA C RENCZ M BENEDEK Z COURTOIS B
Citation: V. Szekely et al., DESIGN FOR THERMAL TESTABILITY (DFTT) AND A CMOS REALIZATION, Sensors and actuators. A, Physical, 55(1), 1996, pp. 29-33
THERMAL MAPPING WITH LIQUID-CRYSTAL METHOD
Authors: CSENDES A SZEKELY V RENCZ M
Citation: A. Csendes et al., THERMAL MAPPING WITH LIQUID-CRYSTAL METHOD, Microelectronic engineering, 31(1-4), 1996, pp. 281-290
COMMENTS ON SELFHEATING EFFECTS IN SILICON RESISTORS OPERATED AT CRYOGENIC AMBIENT-TEMPERATURES
Authors: SZEKELY V
Citation: V. Szekely, COMMENTS ON SELFHEATING EFFECTS IN SILICON RESISTORS OPERATED AT CRYOGENIC AMBIENT-TEMPERATURES, Solid-state electronics, 37(3), 1994, pp. 515-516
IMAGE RECOGNITION PROBLEMS OF FINGERPRINT IDENTIFICATION
Authors: NIKODEMUSZSZEKELY E SZEKELY V
Citation: E. Nikodemuszszekely et V. Szekely, IMAGE RECOGNITION PROBLEMS OF FINGERPRINT IDENTIFICATION, Microprocessors and microsystems, 17(4), 1993, pp. 215-218
Risultati: 1-22 |