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Results: 101-125/1117
Authors:
Joshi, Y
Baelmans, M
Copeland, D
Lasance, CJM
Parry, J
Rantala, J
Citation: Y. Joshi et al., Challenges in thermal modeling of electronics at the system level: summaryof panel held at the Therminic 2000, MICROELEC J, 32(10-11), 2001, pp. 797-800
Authors:
Gerstenmaier, YC
Wachutka, G
Citation: Yc. Gerstenmaier et G. Wachutka, Time dependent temperature fields calculated using eigenfunctions and eigenvalues of the heat conduction equation, MICROELEC J, 32(10-11), 2001, pp. 801-808
Authors:
Franke, T
Froehler, U
Citation: T. Franke et U. Froehler, Thermal modelling of semiconductor packages, MICROELEC J, 32(10-11), 2001, pp. 809-816
Authors:
Codecasa, L
D'Amore, D
Maffezzoni, P
Citation: L. Codecasa et al., Thermal networks for electro-thermal analysis of power devices, MICROELEC J, 32(10-11), 2001, pp. 817-822
Authors:
Pesare, M
Giorgio, A
Perri, AG
Citation: M. Pesare et al., Optimized electrothermal design of integrated devices through the solutionto the non-linear 3-D heat flow equation, MICROELEC J, 32(10-11), 2001, pp. 823-831
Authors:
Vizvary, Z
Furjes, P
Barsony, I
Citation: Z. Vizvary et al., Thermomechanical analysis of hotplates by FEM, MICROELEC J, 32(10-11), 2001, pp. 833-837
Authors:
Driessens, E
Van Dooren, S
Vandevelde, B
Degryse, D
Beyne, E
Heerman, M
Van Puymbroeck, J
Citation: E. Driessens et al., Parametric compact models for the 72-pins polymer stud grid array (TM), MICROELEC J, 32(10-11), 2001, pp. 839-846
Authors:
Sabry, MN
Fikry, W
Salam, KA
Awad, MM
Nasser, AE
Citation: Mn. Sabry et al., A lumped transient thermal model for self-heating in MOSFETs, MICROELEC J, 32(10-11), 2001, pp. 847-853
Authors:
Szczesniak, W
Voss, B
Theisen, M
Becker, J
Glesner, M
Citation: W. Szczesniak et al., Influence of high-level synthesis on average and peak temperatures of CMOScircuits, MICROELEC J, 32(10-11), 2001, pp. 855-862
Authors:
Huang, YJ
Fu, SL
Jen, SL
Guo, MH
Citation: Yj. Huang et al., Fuzzy thermal modeling for MCM placement, MICROELEC J, 32(10-11), 2001, pp. 863-868
Authors:
Miribel-Catala, P
Montane, E
Bota, SA
Puig-Vidal, M
Samitier, J
Citation: P. Miribel-catala et al., MOSFET-based temperature sensor for standard BCD smart power technology, MICROELEC J, 32(10-11), 2001, pp. 869-873
Authors:
Chiueh, H
Draper, J
Choma, J
Citation: H. Chiueh et al., A programmable thermal management interface circuit for PowerPC systems, MICROELEC J, 32(10-11), 2001, pp. 875-881
Authors:
Storti-Gajani, G
Premoli, A
Brambilla, A
Citation: G. Storti-gajani et al., Exploiting electrothermal oscillations for identifying MOSFET thermal parameters, MICROELEC J, 32(10-11), 2001, pp. 883-889
Authors:
Claeys, W
Dilhaire, S
Jorez, S
Patino-Lopez, LD
Citation: W. Claeys et al., Laser probes for the thermal and thermomechanical characterisation of microelectronic devices, MICROELEC J, 32(10-11), 2001, pp. 891-898
Authors:
Dilhaire, S
Jorez, S
Patino-Lopez, LD
Claeys, W
Schaub, E
Citation: S. Dilhaire et al., Laser diode light efficiency determination by thermoreflectance microscopy, MICROELEC J, 32(10-11), 2001, pp. 899-901
Authors:
Malinski, A
Bychto, L
Legowski, S
Szatkowski, J
Zakrzewski, J
Citation: A. Malinski et al., Photoacoustic studies of Zn1-xBexSe mixed crystals: two-layer approach, MICROELEC J, 32(10-11), 2001, pp. 903-910
Authors:
Horvath, I
Panayotatos, P
Lu, YC
Citation: I. Horvath et al., A Si MEMS microbearing with integrated safety sensors for surgical applications, MICROELEC J, 32(1), 2001, pp. 1-9
Authors:
Bhattacharya, SK
Tummala, RR
Citation: Sk. Bhattacharya et Rr. Tummala, Integral passives for next generation of electronic packaging: applicationof epoxy/ceramic nanocomposites as integral capacitors, MICROELEC J, 32(1), 2001, pp. 11-19
Authors:
Strollo, AGM
Napoli, E
De Caro, D
Citation: Agm. Strollo et al., Low-power flip-flops with reliable clock gating, MICROELEC J, 32(1), 2001, pp. 21-28
Authors:
Wong, MWT
Yu, AMF
Li, CK
Citation: Mwt. Wong et al., Application of I-DDQ test in failure analysis of micro-controller devices, MICROELEC J, 32(1), 2001, pp. 29-34
Authors:
Duffy, R
Concannon, A
Mathewson, A
Lane, B
Citation: R. Duffy et al., Scaling embedded EEPROMs for the integration in deep submicron technologies, MICROELEC J, 32(1), 2001, pp. 35-42
Authors:
Kumar, A
Kalra, E
Haldar, S
Gupta, RS
Citation: A. Kumar et al., Low-frequency generation-recombination noise in fully overlapped lightly doped drain MOSFETs, MICROELEC J, 32(1), 2001, pp. 43-47
Authors:
Fissore, A
Alves, MAR
Braga, ED
Cescato, L
Citation: A. Fissore et al., a-C : H films deposited on crystalline silicon to masking it anisotropic etching by aqueous ethylenediamine solution, MICROELEC J, 32(1), 2001, pp. 49-51
Authors:
Tang, Z
Shi, FG
Citation: Z. Tang et Fg. Shi, Stochastic simulation of electromigration failure of flip chip solder bumps, MICROELEC J, 32(1), 2001, pp. 53-60
Authors:
Golan, G
Axelevitch, A
Margolin, R
Rabinovitch, E
Citation: G. Golan et al., Novel approach to sputtered tantalum film resistors with controlled pre-defined resistance, MICROELEC J, 32(1), 2001, pp. 61-67