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Authors: SCHRODER H OBERMEIER E STECKENBORN A
Citation: H. Schroder et al., EFFECTS OF THE ETCHMASK PROPERTIES ON THE ANISOTROPY RATIO IN ANISOTROPIC ETCHING OF (100)SILICON IN AQUEOUS KOH, Journal of micromechanics and microengineering, 8(2), 1998, pp. 99-103

Authors: DIEPOLD T OBERMEIER E BERCHTOLD A
Citation: T. Diepold et al., A MICROMACHINED CONTINUOUS INK-JET PRINT HEAD FOR HIGH-RESOLUTION PRINTING, Journal of micromechanics and microengineering, 8(2), 1998, pp. 144-147

Authors: KRAGL H HOHMANN R MARHEINE C POTT W POMPE G NEYER A DIEPOLD T OBERMEIER E
Citation: H. Kragl et al., INTEGRATED-OPTIC POLYMERIC COMPONENTS FABRICATED WITH MICROSTRUCTUREDSTRIP-OFF COVERS, Electronics Letters, 34(14), 1998, pp. 1396-1398

Authors: KRAUS T BALTZER M OBERMEIER E
Citation: T. Kraus et al., DESIGN AND FABRICATION OF SURFACE MICROMACHINED MICROMOTORS WITH LARGE DIMENSIONS, Journal of micromechanics and microengineering, 7(3), 1997, pp. 196-199

Authors: ZAPPE S BALTZER M KRAUS T OBERMEIER E
Citation: S. Zappe et al., ELECTROSTATICALLY DRIVEN LINEAR MICRO-ACTUATORS - FE ANALYSIS AND FABRICATION, Journal of micromechanics and microengineering, 7(3), 1997, pp. 204-209

Authors: ZAPPE S LEONE M YANG F OBERMEIER E
Citation: S. Zappe et al., CHARACTERIZATION OF SILICON-CARBIDE JFETS WITH RESPECT TO MICROSYSTEMS FOR HIGH-TEMPERATURE APPLICATIONS, Microsystem technologies, 3(3), 1997, pp. 134-138

Authors: REICHERT W LOSSY R SIRGO MG OBERMEIER E SKORUPA W
Citation: W. Reichert et al., INVESTIGATION OF THE EFFECTS OF HIGH-TEMPERATURE IMPLANTATION AND POST IMPLANTATION ANNEALING ON THE ELECTRICAL BEHAVIOR OF NITROGEN-IMPLANTED BETA-SIC FILMS, DIAMOND AND RELATED MATERIALS, 6(10), 1997, pp. 1445-1447

Authors: REICHERT W OBERMEIER E STOEMENOS J
Citation: W. Reichert et al., BETA-SIC FILMS ON SOI SUBSTRATES FOR HIGH-TEMPERATURE APPLICATIONS, DIAMOND AND RELATED MATERIALS, 6(10), 1997, pp. 1448-1450

Authors: BLUET JM CONTRERASAZEMA S CAMASSEL J ROBERT JL DICIOCCIO L REICHERT W LOSSY R OBERMEIER E STOEMENOS J
Citation: Jm. Bluet et al., COMPARISON OF THE ELECTRICAL AND OPTICAL-PROPERTIES OF 3C-SIC ON SOI FROM DIFFERENT ORIGIN, Materials science & engineering. B, Solid-state materials for advanced technology, 46(1-3), 1997, pp. 152-155

Authors: LOSSY R REICHERT W OBERMEIER E
Citation: R. Lossy et al., CHARACTERIZATION OF 3C-SIC DOPED BY NITROGEN IMPLANTATION, Materials science & engineering. B, Solid-state materials for advanced technology, 46(1-3), 1997, pp. 156-159

Authors: REICHERT W STEFAN D OBERMEIER E WONDRAK W
Citation: W. Reichert et al., FABRICATION OF SMOOTH BETA-SIC SURFACES BY REACTIVE ION ETCHING USINGA GRAPHITE ELECTRODE, Materials science & engineering. B, Solid-state materials for advanced technology, 46(1-3), 1997, pp. 190-194

Authors: LOSSY R REICHERT W OBERMEIER E SKORUPA W
Citation: R. Lossy et al., DOPING OF 3C-SIC BY IMPLANTATION OF NITROGEN AT HIGH-TEMPERATURES, Journal of electronic materials, 26(3), 1997, pp. 123-127

Authors: MAIERSCHNEIDER D KOPRULULU A HOLM SB OBERMEIER E
Citation: D. Maierschneider et al., ELASTIC PROPERTIES AND MICROSTRUCTURE OF LPCVD POLYSILICON FILMS, Journal of micromechanics and microengineering, 6(4), 1996, pp. 436-446

Authors: DIEPOLD T OBERMEIER E
Citation: T. Diepold et E. Obermeier, SMOOTHING OF ULTRASONICALLY DRILLED HOLES IN BOROSILICATE GLASS BY WET CHEMICAL ETCHING, Journal of micromechanics and microengineering, 6(1), 1996, pp. 29-32

Authors: JANSEN E OBERMEIER E
Citation: E. Jansen et E. Obermeier, THERMAL-CONDUCTIVITY MEASUREMENTS ON THIN-FILMS BASED ON MICROMECHANICAL DEVICES, Journal of micromechanics and microengineering, 6(1), 1996, pp. 118-121

Authors: JANSEN E DORSCH O OBERMEIER E KULISCH W
Citation: E. Jansen et al., THERMAL-CONDUCTIVITY MEASUREMENTS ON DIAMOND FILMS BASED ON MICROMECHANICAL DEVICES, DIAMOND AND RELATED MATERIALS, 5(6-8), 1996, pp. 644-648

Authors: MUTSCHALL D HOLZNER K OBERMEIER E
Citation: D. Mutschall et al., SPUTTERED MOLYBDENUM OXIDE THIN-FILMS FOR NH3 DETECTION, Sensors and actuators. B, Chemical, 36(1-3), 1996, pp. 320-324

Authors: QIU L HEIN S OBERMEIER E SCHUBERT A
Citation: L. Qiu et al., MICRO GAS-FLOW SENSOR WITH INTEGRATED HEAT SINK AND FLOW GUIDE, Sensors and actuators. A, Physical, 54(1-3), 1996, pp. 547-551

Authors: FRICKE J OBERMEIER E
Citation: J. Fricke et E. Obermeier, AN ACCELEROMETER MADE IN A 2-LAYER SURFACE-MICROMACHINING TECHNOLOGY, Sensors and actuators. A, Physical, 54(1-3), 1996, pp. 651-655

Authors: KRAUSE P OBERMEIER E WEHL W
Citation: P. Krause et al., A MICROMACHINED SINGLE-CHIP INKJET PRINTHEAD, Sensors and actuators. A, Physical, 53(1-3), 1996, pp. 405-409

Authors: JANSEN E OBERMEIER E
Citation: E. Jansen et E. Obermeier, MEASUREMENTS OF THE THERMAL-CONDUCTIVITY OF CVD DIAMOND FILMS USING MICROMECHANICAL DEVICES, Physica status solidi. a, Applied research, 154(1), 1996, pp. 395-402

Authors: DICKERT FL KEPPLER M ZWISSLER GK OBERMEIER E
Citation: Fl. Dickert et al., NETWORKS OF HYDROGEN-BONDS BETWEEN PYRIDONES - STRUCTURE BREAKING EFFECTS BY ORGANIC-SOLVENTS AND SENSOR APPLICATIONS, Berichte der Bunsengesellschaft fur Physikalische Chemie, 100(8), 1996, pp. 1312-1317

Authors: MAIERSCHNEIDER D MAIBACH J OBERMEIER E
Citation: D. Maierschneider et al., A NEW ANALYTICAL SOLUTION FOR THE LOAD-DEFLECTION OF SQUARE MEMBRANES, Journal of microelectromechanical systems, 4(4), 1995, pp. 238-241

Authors: SCHEIBE C OBERMEIER E
Citation: C. Scheibe et E. Obermeier, COMPENSATING CORNER UNDERCUTTING IN ANISOTROPIC ETCHING OF (100) SILICON FOR CHIP SEPARATION, Journal of micromechanics and microengineering, 5(2), 1995, pp. 109-111

Authors: KRAUSE P OBERMEIER E
Citation: P. Krause et E. Obermeier, ETCH RATE AND SURFACE-ROUGHNESS OF DEEP NARROW U-GROOVES IN (110)-ORIENTED SILICON, Journal of micromechanics and microengineering, 5(2), 1995, pp. 112-114
Risultati: 1-25 | 26-42